Touchscreen Electrode Stacking With Preformed Base Projections
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Solution Overview
Problem
Manufacturing electronic display devices, particularly those with touch screens, is complex due to the requirement of multiple layers of electrode patterns, leading to increased thickness and complexity in processing steps.
Innovation Solution
A method of manufacturing electronic devices that allows for easier coupling of conductive patterns at different levels by using a base structure with projections, a first conductive layer, an insulating layer, and a second conductive layer, where the insulating layer's thickness equals the sum of the first pattern and second portion thickness, enabling direct contact without additional etching steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple layers of electrode patterns are added to achieve touch screen functionality, then the device functionality is improved, but the device thickness increases and processing complexity increases
Solution Approach 1:
The patent implements nested conductive layers where a first conductive layer is formed within recesses of a base structure, an insulating layer is deposited over it, and a second conductive layer is formed on top. This nested arrangement allows multiple electrode patterns to be stacked vertically with minimal spacing, achieving touch screen functionality while minimizing overall device thickness.
Solution Approach 2:
The patent transitions from planar electrode patterns to three-dimensional stacked conductive layers. By utilizing the vertical dimension with recesses and insulating layers, the patent enables multiple electrode patterns to coexist in a compact space, reducing the horizontal footprint and enabling thinner device profiles while maintaining multi-layer electrode functionality.
2Adaptability or versatility
If multiple layers of electrode patterns are added to achieve touch screen functionality, then the device functionality is improved, but the processing complexity increases
Solution Approach 1:
The patent forms recesses in the base structure before depositing the first conductive layer. This preliminary action of creating recesses allows subsequent conductive layers to be deposited directly into these pre-formed spaces, simplifying the overall manufacturing process by eliminating the need for complex alignment and positioning steps that would otherwise be required to create multi-layer electrode patterns.
Solution Approach 2:
The insulating layer automatically forms over the first conductive layer and fills the recesses, creating a self-aligned structure. This self-service approach eliminates the need for additional masking and alignment steps, as the insulating layer naturally conforms to the underlying conductive layer topology, thereby reducing processing complexity.
3Reliability
If conventional manufacturing methods are used with etching steps to connect conductive patterns at different levels, then electrical connectivity is achieved, but the number of manufacturing steps increases
Solution Approach 1:
The patent extracts the etching step from the conventional manufacturing process by using pre-formed recesses in the base structure. Instead of etching through insulating layers to create contact holes, the recesses are formed beforehand, allowing direct deposition of conductive material into these spaces, thereby eliminating complex etching operations and reducing the total number of manufacturing steps.
Solution Approach 2:
The recesses are formed in the base structure before any conductive layers are deposited. This preliminary preparation creates ready-made receptacles for the first conductive layer, ensuring automatic alignment and electrical connectivity between layers without requiring subsequent etching or drilling operations, thus streamlining the manufacturing process.
Data Source
AI summary
An electronic device including a base structure, a first pattern having at least one projection disposed on the base structure, a first conductive layer including a first portion disposed on the base structure and a second portion disposed on the first pattern and connected to the first portion, an insulating layer disposed on the first conductive layer covering the first portion and exposing the second portion, and a second conductive layer provided on the insulating layer and overlapping the first conductive layer. The second conductive layer is spaced apart from the first portion and is in contact with the second portion. Methods of manufacturing an electronic device capable of reducing the number of process steps in the manufacturing process are also disclosed.