TPC Power Converter Module Layout for Low Parasitic Inductance
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Solution Overview
Problem
Conventional power converter modules face challenges with high parasitic inductance and size due to the use of printed circuit boards, which affect performance and efficiency, especially in high-power applications.
Innovation Solution
The development of a power converter module utilizing a thick printed copper (TPC) substrate with multiple layers of copper and dielectric, mounted directly on a ceramic core or direct bonded copper substrate, reducing parasitic inductance and size by efficient signal routing and component mounting, and incorporating gallium nitride or other advanced transistors for high-power switching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional printed circuit boards are used in power converter modules, then ease of manufacture is improved, but parasitic inductance increases and performance deteriorates
Solution Approach 1:
The patent changes the physical parameters of the substrate by transitioning from conventional thin printed circuit boards to thick printed copper (TPC) substrates with copper layers ranging from 0.063 inches to 0.250 inches in thickness. This parameter change reduces parasitic inductance while maintaining manufacturability through adapted fabrication processes including copper deposition, patterning, and lamination techniques.
Solution Approach 2:
The patent employs composite material structures by combining thick copper layers with dielectric materials to create TPC substrates. These composite structures integrate multiple functional layers including copper conductors, dielectric insulation, and ceramic cores, achieving both low parasitic inductance and ease of manufacture through optimized material combinations.
2Device complexity
If conventional printed circuit boards are used in power converter modules, then device complexity is reduced, but size increases
Solution Approach 1:
The patent transitions from two-dimensional circuit routing on thin PCBs to three-dimensional thick printed copper substrates. By utilizing the vertical dimension with copper layers extending 0.063 to 0.250 inches thick, the design achieves compact horizontal footprint while maintaining electrical performance, effectively reducing overall module size without increasing device complexity.
Solution Approach 2:
The patent implements nested layering by stacking multiple functional layers within the TPC substrate structure. Copper conductors, dielectric layers, and ceramic cores are nested in a compact vertical arrangement, allowing complex functionality to be integrated in a reduced horizontal space, thereby decreasing module size while managing complexity through structured layering.
3Ease of manufacture
If conventional printed circuit boards are used in power converter modules, then manufacturing simplicity is maintained, but parasitic inductance increases
Solution Approach 1:
The patent modifies the copper layer thickness parameter from conventional thin traces to thick printed copper layers ranging from 0.063 to 0.250 inches. This parameter change directly reduces parasitic inductance by providing lower resistance current paths, while manufacturing simplicity is maintained through adapted printing and deposition processes that can accommodate the increased copper thickness.
Solution Approach 2:
The patent incorporates preliminary action by pre-forming the thick copper patterns and integrating them into the substrate structure before final assembly. The TPC substrates are manufactured with optimized copper trace geometries and thicknesses in advance, which minimizes parasitic inductance from the outset rather than requiring post-manufacturing adjustments, thus maintaining manufacturing simplicity while eliminating harmful parasitic effects.
Data Source
AI summary
A power converter module includes a substrate having a first surface and a second surface that opposes the first surface. The power converter module includes a thick printed copper (TPC) substrate on the first surface of the substrate. The TPC substrate includes a first layer having TPC patterned on the first surface of the substrate and a second layer with dielectric patterned on the first layer. The TPC substrate includes a third layer having TPC patterned on the second layer. The power converter module includes power transistors mounted on the TPC substrate and a control integrated circuit (IC) chip mounted on the TPC substrate.