TPMS Microchannel Heat Sink for Heat Rejection With Lower Pressure Drop

Solution Overview

Problem

Conventional microchannel heat sink designs face a trade-off between thermal performance and hydraulic efficiency, with increased surface area leading to higher pressure drops and elevated pumping power, compromising overall cooling system efficiency.

Innovation Solution

The use of triply periodic minimal surface (TPMS) lattice structures in pin-fins within microchannel units, optimized in dimensions and arrangement, provides a balanced solution that enhances thermal performance while minimizing pressure drops.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional pin fins with increased surface area are used, then heat rejection is improved, but pressure drop increases

Engineering Contradiction:

Improveheat rejectionVSAvoidpressure drop

Core Design Contradiction:

TemperatureVSStress or pressure

Solution Approach 1:

The patent employs curved pin fin geometries with optimized radius ratios (R/H between 0.05-0.15) to reduce flow separation and pressure drop while maintaining enhanced heat transfer surface area. The curved surfaces guide fluid flow more smoothly compared to conventional sharp-edged fins.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent optimizes multiple geometric parameters including pin fin height (H), diameter (D), curvature radius (R), and spacing (S) to achieve the optimal balance between heat transfer surface area and flow resistance. Specific parameter ranges are established through systematic optimization.

Inventive Principle:

Principle #35Parameter changes

2Temperature

If conventional pin fins are used to increase surface area, then thermal performance is improved, but pumping power increases

Engineering Contradiction:

Improvethermal performanceVSAvoidpumping power

Core Design Contradiction:

TemperatureVSUse of energy by stationary object

Solution Approach 1:

Curved pin fin surfaces reduce flow separation and turbulence losses, thereby decreasing the pumping power required to maintain coolant flow through the heat sink while preserving thermal performance.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

Optimized geometric parameters including reduced pin fin height-to-diameter ratios and increased spacing reduce flow resistance and pumping power requirements while maintaining effective heat dissipation.

Inventive Principle:

Principle #35Parameter changes

3Stress or pressure

If streamlined pin fins are used, then pressure drop is reduced, but cooling performance decreases

Engineering Contradiction:

Improvepressure dropVSAvoidcooling performance

Core Design Contradiction:

Stress or pressureVSTemperature

Solution Approach 1:

The patent employs curved pin fin geometries with optimized radius ratios (R/H between 0.05-0.15) to reduce flow separation and pressure drop while maintaining enhanced heat transfer surface area. The curved surfaces guide fluid flow more smoothly compared to conventional sharp-edged fins.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent optimizes multiple geometric parameters including pin fin height (H), diameter (D), curvature radius (R), and spacing (S) to achieve the optimal balance between heat transfer surface area and flow resistance.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The TPMS lattice structure microchannel heat sinks achieve superior cooling performance with reduced pressure drops, maintaining thermal efficiency and hydraulic efficiency, thus optimizing the cooling system's effectiveness.

Implementation Method 1

Each pin-fin comprises a triply periodic minimal surface (TPMS) lattice structure

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The plurality of microchannel units are arranged in parallel and at regular intervals on the base. Each microchannel unit comprises two or more pin-fins

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS12538800B1Microchannel heat sink with TPMS finned structures for enhanced thermal efficiency

Publication Date: 2026.01.27 UNITED ARAB EMIRATES UNIVERSITY

AI summary

The present disclosure in general relates to the field of heat sinks (e.g. microchannel heat sinks). The present disclosure is further directed towards a microchannel heat sink for applications in microchips. The microchannel heat sink comprises a base and a plurality of microchannel units extending from the base. The plurality of microchannel units are arranged in parallel and at regular intervals on the base. Each microchannel unit comprises two or more pin-fins. Each pin-fin comprises a triply periodic minimal surface (TPMS) lattice structure. The present disclosure also relates to pin-fins comprising triply periodic minimal surface (TPMS) lattice structure.