Trace-Gimbal Extension Prevents Solder Bridging in HAMR Slider

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Solution Overview

Problem

In heat-assisted magnetic recording (HAMR) technologies, existing designs face challenges in preventing solder bridging between the laser submount and the slider body, which can lead to electrical shorts during the assembly of miniature optical and mechanical components.

Innovation Solution

The solution involves recessing the laser submount from the trailing edge of the slider body and extending insulating/dielectric layers between the solder joints to prevent contact and bridging, ensuring that molten solder does not connect the bond pads, thereby maintaining electrical isolation and preventing shorts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If the laser submount is recessed from the trailing edge and bond pads are positioned close together to save space, then the compactness of the assembly is improved, but the risk of solder bridging between bond pads increases

Engineering Contradiction:
Improveassembly footprintVSAvoidelectrical connection reliability
Core Design Contradiction:
Area of moving objectVSReliability

Solution Approach 1:

An extension of the insulating layer is introduced as an intermediary barrier between the first and second bond pads. This extension protrudes into the coupling region and physically separates the solder joints, preventing molten solder from bridging between adjacent bond pads while still allowing the compact layout to be maintained

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The solution moves from a two-dimensional planar separation to a three-dimensional approach by extending the insulating layer vertically and horizontally into the coupling region. This creates a spatial barrier that prevents solder bridging without increasing the overall footprint of the assembly

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If the bond pads are positioned closer together to reduce assembly size, then the miniaturization is improved, but the likelihood of solder bridging increases

Engineering Contradiction:
Improveassembly miniaturizationVSAvoidsolder bridging risk
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The insulating layer extension serves as a mediator that allows bond pads to be positioned close together for miniaturization while simultaneously preventing the harmful effect of solder bridging. The extension creates a physical barrier that maintains electrical isolation even when bond pads are in close proximity

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The coupling region is segmented by the insulating layer extension, which divides the space between bond pads into isolated zones. This segmentation prevents the continuous path that molten solder would need to create a bridge, allowing compact positioning without increasing bridging risk

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS8705324B2Trace-gimbal assembly with extension that prevents contact between solder joints
Publication Date: 2014.04.22 SEAGATE TECH LLC
  • US8705324B2 patent drawing
  • US8705324B2 patent drawing
  • US8705324B2 patent drawing

AI summary

An apparatus has a slider body that includes an upper surface opposed to a media-facing surface. The slider body has an edge joined between the media-facing surface and the upper surface and facing a coupling region. The slider body includes a first bond pad on the edge and a laser submount coupled to the upper surface of the slider body. The laser submount has a second bond pad facing the coupling region. The apparatus includes a trace-gimbal assembly having first and second electrical traces facing the coupling region and electrically coupled to the respective first and second bond pad via first and second solder joints. An extension of the trace-gimbal assembly extends between the first and second solder joints preventing contact therebetween.