Trace-Routable Radiation Shield for EMI Control in Dense Substrates
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Solution Overview
Problem
Increasing density of computing elements in electronic devices leads to elevated electromagnetic interference (EMI) and radio-frequency interference (RFI) noise levels, causing performance reduction, device lifetime issues, and data throughput delays, while traditional shielding solutions are costly, mechanically cumbersome, and ineffective in high-density systems.
Innovation Solution
A trace routable radiation shield is integrated into the substrate, featuring a trace routable fence that allows for extra routing layers without increasing Z-height, enabling the routing of traces through its walls to mitigate radiation interference and improve signal integrity, and is secured with a radiation lid for effective shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If computing elements are increased in density to improve performance, then processing capability is improved, but electromagnetic interference and radio-frequency interference noise levels increase causing performance reduction and data throughput delays
Solution Approach 1:
The radiation shield is merged with the substrate structure, forming an integrated solution where the shield becomes part of the substrate itself rather than a separate component. This integration allows the shield to protect sensitive areas while maintaining the high-density layout of computing elements on the substrate.
Solution Approach 2:
The radiation shield utilizes the Z-dimension (vertical dimension) by extending upward from the substrate surface. This dimensional approach allows shielding without consuming additional planar space, enabling the shield to protect against electromagnetic and radio-frequency interference while maintaining the high-density two-dimensional arrangement of computing elements.
2Object-affected harmful factors
If traditional shielding solutions are used to reduce electromagnetic interference and radio-frequency interference, then radiation protection is improved, but cost increases and mechanical complexity increases
Solution Approach 1:
The radiation shield is merged with the substrate structure, forming an integrated solution where the shield becomes part of the substrate itself rather than a separate component. This integration eliminates the need for additional mechanical assemblies, reducing both cost and mechanical complexity while maintaining effective radiation protection.
Solution Approach 2:
The substrate itself acts as an intermediary structure that combines both the functional circuit board role and the radiation shielding role. By making the substrate trace-routable and radiation-shielding simultaneously, the solution eliminates the need for separate traditional shielding components and their associated mechanical complexity.
3Object-affected harmful factors
If traditional shielding solutions are used to reduce electromagnetic interference and radio-frequency interference, then radiation protection is improved, but manufacturing cost increases
Solution Approach 1:
The radiation shield is merged with the substrate structure, allowing both to be manufactured as a single integrated component. This consolidation reduces the number of separate manufacturing processes, assembly steps, and associated costs while maintaining effective radiation protection.
Solution Approach 2:
The substrate serves as an intermediary that combines multiple functions (circuit support and radiation shielding) into one component. This approach eliminates the need for separate traditional shielding components, reducing material costs, assembly costs, and overall manufacturing complexity.
4Productivity
If trace routing is attempted in high-density systems to maintain connectivity, then system functionality is maintained, but trace routing difficulty increases
Solution Approach 1:
The radiation shield's vertical extension into the Z-dimension creates additional spatial room above the substrate surface. This extra dimension provides more routing space for traces without requiring increased planar density, thereby reducing trace routing difficulty while maintaining system functionality in high-density configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI and RFI noise, enhances signal integrity, and optimizes space usage in high-density systems by allowing for more efficient trace routing and power delivery, thereby improving device performance and longevity without the mechanical and cost constraints of traditional shielding methods.
Implementation Method 1
a radiation shield. The radiation shield can help shield a radiation sensitive device from the radiation of the radiation source
Data Source
AI summary
Particular embodiments described herein provide for an electronic device that can be configured to include a substrate that includes traces, a radiation source on the substrate, and a trace routable radiation shield on the substrate. At least a portion of the traces extend through the trace routable radiation shield and the trace routable radiation shield can help shield radiation sensitive components from at least a portion of the radiation from the radiation source.