3D-Printed Tracking Antenna Array With Corporate Combiner Network
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Solution Overview
Problem
Traditional hollow metal waveguide antenna arrays face challenges in size, weight, and cost due to complex fabrication methods, leading to increased size, weight, and part count, which reduces performance and is particularly limiting in applications like small satellites where SWaP constraints are stringent.
Innovation Solution
The development of an integrated tracking antenna array using a three-dimensional printing process that combines electromagnetic, structural, and thermal performance metrics into a single part, reducing weight and size while maintaining performance through a combiner network with corporate combiners and repositionable units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional hollow metal waveguide antenna arrays are used, then electromagnetic performance can be maintained, but size and weight increase significantly
Solution Approach 1:
The patent combines multiple antenna elements and their supporting structures into a single integrated 3D printed component. The waveguide structures, radiating elements, and mechanical support features are merged into one monolithic part, eliminating the need for separate waveguide sections, flanges, and fasteners that would otherwise be required in traditional assemblies.
Solution Approach 2:
The integrated antenna array structure performs multiple functions simultaneously: it provides electromagnetic waveguiding, structural support, thermal management pathways, and mechanical mounting interfaces. The single 3D printed component serves as both the electromagnetic structure and the mechanical framework, replacing multiple specialized components.
2Strength
If traditional multi-piece fabrication methods are used, then structural strength can be ensured, but manufacturing complexity and part count increase
Solution Approach 1:
Multiple structural components are merged into a single 3D printed part. The waveguide sections, support structures, mounting features, and thermal management elements are all integrated into one monolithic component, eliminating the need for assembly and reducing part count while maintaining structural integrity through the additive manufacturing process.
Solution Approach 2:
The patent utilizes 3D printing parameters and material deposition techniques to achieve structural strength comparable to or exceeding traditional multi-piece constructions. The additive manufacturing process allows for optimized material distribution and internal structures that provide necessary mechanical properties while reducing overall complexity.
3Volume of moving object
If antenna array size is reduced for small satellite applications, then SWaP constraints are met, but fabrication complexity increases
Solution Approach 1:
The integration of multiple functions into a single 3D printed component simplifies manufacturing for compact antenna arrays. Rather than assembling multiple precision-machined parts to achieve the required compact size, the entire structure is fabricated in one additive manufacturing process, which is particularly advantageous for small-scale, complex geometries.
Solution Approach 2:
The 3D printing process enables the fabrication of complex, space-efficient geometries that would be difficult or impossible to manufacture using traditional methods. The additive manufacturing parameters can be optimized to produce the required compact form factor with appropriate mechanical properties, simplifying the overall fabrication process for small satellite applications.
Data Source
AI summary
A combiner network is provided. A combiner network may include a corporate combiner. The corporate combiner may include a first plurality of radiation elements. The corporate combiner may include a first H-plane combiner connected to the first plurality of radiation elements and connected by a U-bend to a first E-plane combiner. The corporate combiner may include a second H-plane combiner connected to the first E-plane combiner. The corporate combiner may further include a first port. A plurality of corporate combiners may be assembled together as a combiner network.