Trackpad Haptic Structure With Nested Piezoelectric Transducer
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Solution Overview
Problem
Existing electronic devices for providing haptic effects, such as those using piezoelectric transducers, face challenges in achieving a balance between thickness, robustness, and efficient haptic effect transfer, particularly in applications like laptop trackpads where thinness and robustness are crucial.
Innovation Solution
The device incorporates a substrate layer with a depression to house a piezoelectric transducer, a touch-interface surface, and a printed circuit board (PCB) layer, along with a carrier structure and support elements, which enhances haptic effect transfer and robustness while maintaining thinness, using conductive adhesives and soldered joints for efficient signal routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a piezoelectric transducer is used to provide haptic effects, then haptic feedback capability is improved, but device thickness increases
Solution Approach 1:
The piezoelectric transducer is nested within a depression formed in the substrate layer, allowing the haptic actuator to be housed within the existing structure rather than adding external thickness. The depression accommodates the piezoelectric element while maintaining a compact overall device profile.
Solution Approach 2:
The invention transitions from a planar substrate to a three-dimensional structure by forming a depression in the substrate layer. This vertical dimensionality change allows the piezoelectric transducer to be positioned within the substrate thickness rather than adding to it, effectively solving the thickness problem while maintaining haptic functionality.
2Length of moving object
If the device is made thinner, then device thickness is reduced, but structural robustness deteriorates
Solution Approach 1:
By nesting the piezoelectric transducer within the depression of the substrate layer, the structure achieves compactness without sacrificing robustness. The substrate layer itself provides structural support while housing the haptic actuator, eliminating the need for additional protective layers that would increase thickness.
Solution Approach 2:
The device employs a composite structure combining the substrate layer with integrated piezoelectric elements and conductive adhesive layers. This composite approach maintains structural integrity while achieving thinness, as each layer contributes specific functions without requiring separate protective enclosures.
3Reliability
If support elements are added to transfer haptic effects, then haptic transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The support function is merged with the substrate layer itself, which provides both structural support and haptic transfer pathways. The conductive adhesive layers serve dual purposes of electrical connection and mechanical support, eliminating the need for separate support elements and reducing overall structural complexity.
Solution Approach 2:
The substrate layer performs multiple functions simultaneously: it provides structural support, houses the piezoelectric transducer via the depression, and serves as a haptic transfer medium. This multi-functionality reduces the need for additional dedicated support components, maintaining simplicity while achieving efficient haptic transfer.
4Ease of manufacture
If conductive adhesive layers are used for electrical connections, then manufacturing simplicity is improved, but connection reliability may deteriorate
Solution Approach 1:
The electrical connection function is merged with the mechanical bonding function in the conductive adhesive layers. These layers simultaneously provide structural adhesion between components and electrical connectivity, simplifying manufacturing by eliminating separate wiring steps while maintaining reliable connections through the dual-function adhesive material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a more robust and efficient transfer of haptic effects to the touch-interface surface, improving user experience by providing a balanced thickness and robustness, while also simplifying manufacturing and reducing the need for multiple connectors.
Implementation Method 1
at least one piezoelectric transducer on the second side of the substrate layer comprising a support plate and a piezoelectric element
Data Source
AI summary
A device comprises a substrate layer having a first side and a second side. The second side of the substrate layer comprises at least one depression. The device comprises a touch-interface surface on the first side of the substrate layer. The device comprises at least one piezoelectric transducer on the second side of the substrate layer comprising a support plate and a piezoelectric element. The at least one piezoelectric transducer is aligned with the at least one depression of the substrate layer. The device comprises a printed circuit board layer electrically coupled to the piezoelectric element of the piezoelectric transducer. A device and a trackpad are provided.