Optical Transceiver Metal Cavity Resonance Control
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Solution Overview
Problem
Optical transceiver modules face challenges in reducing unnecessary electromagnetic waves at frequencies of 10 GHz and 20 GHz due to cavity resonance, which existing technologies fail to adequately address without increasing costs or compromising component mounting capacity.
Innovation Solution
A metal casing structure with a partition wall inside the casing, controlling the cavity resonant frequency by adjusting the gap between the partition wall and the printed circuit board, effectively shifting the eigenmode frequency away from problematic frequencies and enhancing shielding without increasing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional technologies are used to reduce electromagnetic waves, then shielding effect is improved, but cost increases
Solution Approach 1:
The internal cavity is segmented into multiple regions by adding partition walls that extend from the front surface to the rear surface. This segmentation divides the cavity into first, second, and third regions, preventing electromagnetic waves from propagating freely across the entire cavity and reducing radiation at problematic frequencies
Solution Approach 2:
The partition walls are positioned at specific distances from the front surface (creating depth dimension variations) and extend across the cavity to divide it into multiple regions. This dimensional approach creates electromagnetic isolation zones without requiring additional shielding materials or complex external structures
2Object-affected harmful factors
If conventional technologies are used to reduce electromagnetic waves, then shielding effect is improved, but device complexity increases
Solution Approach 1:
The partition walls are integrated directly into the casing structure, merging the shielding function with the existing mechanical housing. The partition walls form part of the casing's internal architecture rather than being separate additive components, maintaining structural integrity while providing electromagnetic isolation
Solution Approach 2:
The partition walls serve multiple functions: they provide electromagnetic isolation to reduce radiation, maintain structural support within the cavity, and organize the spatial arrangement of internal components. This multi-functionality reduces the need for separate shielding structures
3Object-affected harmful factors
If partition wall is added to control cavity resonance, then electromagnetic wave radiation is reduced, but component mounting capacity is constrained
Solution Approach 1:
The partition walls are positioned strategically within the cavity at specific distances from the front surface, creating localized electromagnetic isolation zones. This allows electromagnetic control in specific regions without blocking the entire cavity, preserving mounting areas in other regions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces unnecessary electromagnetic waves at 10 GHz and 20 GHz frequencies, achieving a shielding effect of 30 dB or more while maintaining component mounting capacity and avoiding cost increases.
Implementation Method 1
cavity resonance, which existing technologies fail to adequately address
Implementation Method 2
enhancing shielding without increasing costs
Data Source
AI summary
Provided is a metal casing structure capable of avoiding a cavity resonance at 10 GHz and 20 GHz by controlling an eigenmode frequency in an inner space of a casing without involving an increase in cost, and a 10 Gbit/s optical transceiver module which achieves reduction in unnecessary electromagnetic waves and cost. In the optical transceiver module, a metal casing having a cavity therein is formed by an upper casing (100) and a lower casing (101), a metal partition wall (103, 104) is provided on at least one of the upper casing (100) and the lower casing (101) near a central portion of the casing in a direction parallel to a direction connecting a front and a rear thereof, and a length of a gap between the partition wall (103, 104) and a printed circuit board (102) is adjusted.