Transceiver Cooling Jacket with Heat Pipes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Data centers face challenges in efficiently removing heat generated by densely packed electronic components, particularly transceivers, which can lead to accelerated aging and premature failure due to inadequate cooling systems.
Innovation Solution
A heat dissipating apparatus featuring a cooling jacket with thermally conductive materials and embedded heat pipes or vapor chambers connected to a heat dissipation device, such as a radiator, to effectively transfer heat away from transceivers and dissipate it into cooler air.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If transceivers are densely packed to increase interconnection capacity, then bandwidth and storage capacity improve, but heat generation increases leading to overheating and component failure
Solution Approach 1:
A cooling jacket made of thermally conductive material is introduced as an intermediary between the transceiver and the environment. The cooling jacket receives the transceiver and transfers heat away from it, enabling dense packing while managing thermal loads through the mediating cooling structure
Solution Approach 2:
The patent employs heat pipes and vapor chambers (hydraulic/phase-change mechanisms) within the cooling jacket to efficiently transport heat. These hydraulic/thermodynamic elements move thermal energy from the transceiver through phase change and fluid circulation, resolving the heat accumulation problem in dense configurations
2Device complexity
If traditional cooling methods are used, then simplicity is maintained, but heat removal efficiency is insufficient for high-density transceiver configurations
Solution Approach 1:
The cooling jacket is constructed from composite or alloy materials with high thermal conductivity (such as aluminum alloys, copper alloys, or diamond composites). This composite material approach enhances heat transfer efficiency while maintaining structural integrity and reasonable complexity
Solution Approach 2:
The cooling system incorporates phase change mechanisms through heat pipes and vapor chambers. These components utilize phase transitions (liquid-vapor cycles) to efficiently transport heat away from transceivers, significantly improving heat removal efficiency without proportionally increasing system complexity
3Temperature
If cooling devices are added to manage heat, then temperature control improves, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The cooling devices (heat pipes, vapor chambers) are integrated into the cooling jacket structure itself, merging the cooling function with the mechanical housing. This consolidation improves temperature control while reducing manufacturing complexity compared to separate cooling components
Solution Approach 2:
The cooling jacket serves multiple functions: it provides structural support for the transceiver, acts as a thermal conduction path, and houses the phase-change cooling devices. This multi-functionality reduces the number of separate components needed, improving temperature control without proportionally increasing manufacturing difficulty
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced cooling for transceivers, reducing the risk of premature failure and maintaining high-bandwidth performance by efficiently managing heat dissipation in densely packed electronic systems.
Implementation Method 1
cooling devices embedded in the first portion and the second portion of the cooling jacket, respectively, where the cooling devices are made of a highly thermal conductivity material
Implementation Method 2
the cooling devices include at least one heat pipe made up of highly conductive material
Implementation Method 3
the cooling devices include at least one vapor chamber made up of highly conductive material
Data Source
Figure 1~2
Figure 3~4
Figure 5A~5B
AI summary
A heat dissipating apparatus for cooling a transceiver is provided. The apparatus includes a cooling jacket configured to receive the transceiver. The transceiver is secured within the cooling jacket via a connecting structure. The apparatus also includes cooling devices secured to an exterior surface of the cooling jacket, the plurality of cooling devices comprising a highly thermal conductivity material. The apparatus also includes a heat dissipation device connected to a distal end of each of the plurality of cooling devices.