Ground Clip for Transceiver Module PCB Chassis Grounding
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Solution Overview
Problem
Transceiver modules face challenges in providing effective chassis ground to electronic circuitry on printed circuit boards due to space constraints, leading to increased parasitic conductance from lengthy links, which affects the proper operation of the module.
Innovation Solution
A ground clip with a cross-arm, arms, fingers, and protrusions is used to establish a short, reliable electrical connection between the printed circuit board and the transceiver module housing, ensuring proper grounding without interfering with other components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a lengthy link is used to connect chassis ground to electronic circuitry, then the ground connection can reach the circuitry, but parasitic conductance increases and grounding effectiveness deteriorates
Solution Approach 1:
The ground clip creates a localized grounding structure that places ground contacts in immediate proximity to the electronic circuitry on the printed circuit board. By concentrating the grounding function at the specific location where it is needed rather than using a lengthy distributed connection, the patent eliminates parasitic conductance while maintaining effective grounding. The clip structure allows ground contacts to be positioned directly adjacent to circuit components, achieving local optimal grounding quality.
2Productivity
If space constraints are considered in transceiver module design, then component density increases, but available space for grounding connections decreases
Solution Approach 1:
The ground clip is designed to nest within the existing transceiver module structure, utilizing the space between the printed circuit board and the module housing. The clip structure fits into the available void space, with its arms extending to contact ground points on the PCB and its body nesting against the module housing. This nesting approach allows the grounding mechanism to occupy minimal space while still providing effective grounding connections, thereby maintaining high component density.
Solution Approach 2:
The ground clip utilizes the third dimension (vertical space) rather than requiring additional horizontal area on the printed circuit board. By extending arms vertically from the PCB upward toward the module housing, the clip creates grounding connections in the vertical dimension, leaving the horizontal PCB surface area available for other components. This dimensional approach allows effective grounding without compromising component density.
3Reliability
If a short ground link is used to reduce parasitic conductance, then grounding effectiveness improves, but the complexity of fitting the grounding structure increases
Solution Approach 1:
The ground clip is segmented into multiple functional parts: a body portion that nests against the housing, multiple arms that extend to contact different ground points on the PCB, and ground contacts at the arm tips. This segmentation allows each part to perform its specific function independently while collectively achieving effective grounding. The modular segmented structure simplifies the overall design by breaking down the complex grounding requirement into manageable discrete elements that are easier to manufacture and assemble.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces parasitic conductance and enhances the electrical robustness of the transceiver module by providing a stable chassis ground to the printed circuit board, improving noise handling and operational efficiency.
Implementation Method 1
The at least one protrusion is configured to bias against, and make reliable electrical contact with, a portion of a transceiver module that is electrically connected to a housing of the transceiver module
Implementation Method 2
Each finger is configured to be inserted into a hole in a connector structure and configured to be electrically connected to ground contacts of a printed circuit board
Data Source
AI summary
A transceiver module that utilizes an apparatus for providing chassis ground to a printed circuit board located within a connector structure of the transceiver module. In one example embodiment, a ground clip for use in a transceiver module includes a cross-arm, a pair of arms connected to the cross-arm, a pair of fingers each connected to one of the pair of arms, and at least one protrusion connected to the cross-arm. Each finger is configured to be inserted into a hole in a connector structure and configured to be electrically connected to ground contacts of a printed circuit board. The at least one protrusion is configured to bias against, and make reliable electrical contact with, a portion of a transceiver module that is electrically connected to a housing of the transceiver module.