Optical Transceiver Module Heat Bridge for PCB-Side Dissipation

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Solution Overview

Problem

Electronic modules, particularly those with heat-producing components like VCSELs, laser drivers, and photo diodes, face challenges in dissipating heat from the side of the casing facing the PCB due to materials with low thermal conductivity, making it difficult to efficiently transfer heat away from the electronic devices.

Innovation Solution

A table-like heat dissipating element with legs is used to establish a thermal path from the heat-producing components on the PCB to the casing, utilizing thermally conductive materials like aluminum or copper, and optionally a heat transfer medium for enhanced conductivity, allowing heat to be dissipated to the casing's inner surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a component made of material with low thermal conductivity is used to provide optical path or position optical fibers, then optical functionality is achieved, but heat dissipation from the PCB side is insufficient

Engineering Contradiction:

Improveoptical functionalityVSAvoidheat dissipation

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The heat dissipating element is segmented into a table top portion covering the heat-producing component and multiple leg portions extending to contact the PCB. This segmentation allows the element to simultaneously provide mechanical support/positioning and establish multiple thermal contact paths with the PCB for effective heat dissipation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat dissipating element acts as an intermediary between the heat-producing electronic component and the PCB. It provides a thermal bridge through its leg portions that contact the PCB, enabling heat transfer from the component to the PCB while the table top portion maintains contact with or covers the component.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If the module is designed as a plug-in or connector module, then adaptability is improved, but heat dissipation from the casing side facing the PCB is prevented

Engineering Contradiction:

Improveplug-in capabilityVSAvoidheat dissipation

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The heat dissipation path is extended into a new dimension by having the heat dissipating element's leg portions extend downward to contact the PCB from the component side. This creates a vertical thermal path through the component and into the PCB, bypassing the limitation of the connector cage design that blocks horizontal heat dissipation from the casing.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Temperature

If the legs are positioned close to the heat-producing component, then thermal resistance is reduced, but manufacturing precision requirements increase

Engineering Contradiction:

Improvethermal resistanceVSAvoidleg positioning

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The heat dissipating element exhibits local quality by concentrating its heat dissipation function at specific locations where the leg portions contact the PCB near the heat-producing component. This localized thermal contact provides effective heat dissipation while the element's overall structure maintains mechanical stability and ease of manufacturing.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively transfers over 80% of the heat generated by components like VCSELs, laser drivers, and photo diodes to the upper casing part, reducing thermal resistance and preventing component deterioration or destruction.

Implementation Method 1

The table top covers the at least one heat producing electronic device and the legs contact the mounting surface in an area surrounding the at least one heat producing electronic device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240137125A1Electronic Module, Especially Optical Transceiver Module

Publication Date: 2024.04.25 ADTRAN NETWORKS SE

AI summary

The invention relates to an electronic module, especially an optical transceiver module, including a casing, at least a portion of which consists of a thermally conductive material adapted to dissipate heat to the surrounding air or to a neighboring heat sink (heat dissipating portion); and a printed circuit board provided within the casing, the printed circuit board carrying at least one heat producing electronic device on a mounting surface thereof. A table-like heat dissipating element having one or more legs extending from a table top is provided on the mounting surface. The table top covers the at least one heat producing electronic device and the one or more legs contact the mounting surface in an area surrounding the at least one heat producing electronic device. An upper surface of the table top either directly or indirectly contacts an inner surface of the heat dissipating portion of the casing.