Transceiver Module Contact Pad Array for High Density Data Transmission

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Solution Overview

Problem

Optical communication systems face limitations in increasing the speed, density, and number of channels in data transmission due to constraints in arranging transceiver modules and contact terminals within a predetermined chassis.

Innovation Solution

The transceiver module design includes multiple module boards with contact pads arrayed in parallel at predetermined intervals, connected via plug connectors, and a receptacle assembly with a module slot and connector accommodating portion to enhance data transmission speed, density, and channel capacity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the number of contact terminals is increased by reducing intervals, then channel capacity increases, but manufacturing precision requirements worsen

Engineering Contradiction:
Improvenumber of contact terminalsVSAvoidinterval precision of contact terminals
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The contact pad array is divided into multiple groups (first contact pad array and second contact pad array) arranged in different directions. This segmentation allows each group to be manufactured with standard precision while achieving high overall channel capacity through the combined effect of multiple groups.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The contact pads are arranged not only in one direction but also in multiple directions (first contact pad array and second contact pad array at different orientations). This multi-dimensional arrangement increases the number of channels without requiring reduced intervals in a single direction, thereby avoiding increased manufacturing precision requirements.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Quantity of substance

If transceiver modules are arranged in juxtaposition on a common plane, then channel capacity increases, but device complexity worsens

Engineering Contradiction:
Improvechannel capacityVSAvoidarrangement complexity of transceiver modules
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

Instead of arranging transceiver modules only in one direction on a common plane, the contact pads are arranged in multiple directions (first contact pad array and second contact pad array). This multi-dimensional arrangement increases channel capacity while maintaining a simple common plane configuration, avoiding increased device complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Device complexity

If contact terminals are arranged in a single line, then device complexity is reduced, but channel capacity is limited

Engineering Contradiction:
Improvecontact terminal arrangementVSAvoidchannel capacity
Core Design Contradiction:
Device complexityVSQuantity of substance

Solution Approach 1:

The contact pad array is segmented into multiple groups (first contact pad array and second contact pad array) arranged in different directions. This segmentation enables the system to achieve high channel capacity equivalent to multiple lines while maintaining a unified array structure that is simpler than multiple separate contact terminal lines.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The contact pads are arranged in multiple directions rather than a single line, creating a multi-dimensional contact pad array. This approach increases channel capacity by utilizing spatial arrangement in multiple orientations while maintaining structural simplicity through a unified array design.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9759879B1Transceiver module, transceiver module receptacle assembly and transceiver module assembly
Publication Date: 2017.09.12 YAMAICHI ELECTRONICS CO LTD
  • US9759879B1 patent drawing
  • US9759879B1 patent drawing
  • US9759879B1 patent drawing

AI summary

An electrode portion of a module board to be disposed in a transceiver module is formed from a group of contact pads which are arrayed substantially in parallel to a long side of the module board, and the group of contact pads include a line of ground line pads formed at predetermined intervals from one end to the other end, and two lines of signal line pads formed in spaces between the ground line pads.