Optical Transceiver Partition Plate EMI Shielding
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Solution Overview
Problem
The existing pluggable optical transceivers face challenges in reducing cost and electromagnetic interference (EMI) shielding due to the replacement of metal components with resin, which results in reduced stiffness and increased width, necessitating additional shielding measures that complicate the design.
Innovation Solution
The optical transceiver incorporates a resin-made optical coupling member with a polygonal cross-section and a metal partition plate that provides stiffness and EMI shielding, arranged in a side-by-side configuration with a TOSA and ROSA, and includes a method for assembly that prevents twisting during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If resin made optical coupling member is used to reduce cost, then manufacturing cost is reduced, but stiffness is insufficient
Solution Approach 1:
The patent uses a resin-made optical coupling member with a polygonal cross-section that combines different materials and structural features. The polygonal shape with flat surfaces provides structural reinforcement while maintaining resin construction, creating a composite solution that achieves both cost reduction and sufficient stiffness.
Solution Approach 2:
The optical coupling member has varying wall thickness with different structural properties in different regions. The flat surfaces have specific thickness characteristics that differ from other portions, providing localized stiffness where needed while maintaining overall cost efficiency through resin construction.
2Object-affected harmful factors
If metal package is used to provide EMI shielding, then electromagnetic interference shielding is improved, but cost increases
Solution Approach 1:
The patent replaces expensive metal packages with resin-made optical coupling members that provide sufficient EMI shielding at lower cost. The resin construction with optimized polygonal geometry achieves acceptable EMI protection without the high material and manufacturing costs of metal packages.
Solution Approach 2:
The patent changes the material parameter from metal to resin and optimizes the geometric parameters (polygonal cross-section, wall thickness distribution) to achieve the required EMI shielding performance at reduced cost, balancing electromagnetic protection with manufacturing economy.
3Strength
If wall thickness of resin made package is increased to compensate for lesser stiffness, then stiffness is improved, but full width increases beyond MSA limitation
Solution Approach 1:
The patent implements non-uniform wall thickness distribution in the resin-made optical coupling member. The flat surfaces have optimized thickness to provide necessary stiffness, while other portions have different thickness characteristics. This local variation allows achieving required mechanical strength without uniformly increasing the overall width beyond MSA specifications.
Solution Approach 2:
The polygonal cross-section design with varied wall thickness creates a composite-like structure within the resin material, concentrating stiffness where needed (flat surfaces) while minimizing overall width, thereby satisfying both mechanical and dimensional constraints.
4Object-affected harmful factors
If partition plate is added to provide EMI shielding, then electromagnetic interference shielding is improved, but full width increases
Solution Approach 1:
The patent merges the EMI shielding function with the structural support function by integrating the partition plate into the existing transceiver structure. The partition plate is positioned to provide EMI shielding between TOSA and ROSA while fitting within the existing width constraints, combining multiple functions without increasing full width.
Solution Approach 2:
The partition plate serves as an intermediary element that provides EMI shielding while maintaining compatibility with the existing MSA-defined width. It acts as a mediator between the conflicting requirements of EMI protection and dimensional constraints, achieving shielding without exceeding width limitations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains sufficient stiffness and reduces the overall width of the transceiver while enhancing EMI shielding efficiency, ensuring secure assembly and reduced crosstalk noise.
Implementation Method 1
the metal partition plate may come in physically contact with the metal ground plate assembled to the optical receptacle so as to trace the outline of the optical receptacle
Implementation Method 2
The TOSA and the ROSA each includes an optical coupling member made of resin with the polygonal cross section and a bore in a center portion thereof. This coupling portion has a thickness in portion of the flat surfaces less than a thickness in portions except the flat surfaces. Thus, the optical transceiver of the present invention, even if the optical coupling member is made of resin which shows less stiffness than metal, may arrange two optical subassemblies in side-by-side configuration as having the sufficient stiffness in portions except the flat surfaces.
Implementation Method 3
one of the flat surfaces of the TOSA faces one of the flat surfaces of the ROSA as putting the partition plate therebetween. The metal partition plate may come in physically contact with the metal ground plate assembled to the optical receptacle so as to trace the outline of the optical receptacle. The partition plate, in a portion coming in contact with the optical receptacle through the ground plate, is preferable to trace the cross section of the optical receptacle, which prevents the partition plate from misarranging back-to-front.
Data Source
AI summary
An SFP transceiver with two subassemblies each having an optical coupling member with a polygonal cross section is disclosed. The polygonal cross section has a flat surface facing the flat surface of the other subassembly. Between flat surfaces is put with a metal partition plate that comes in contact with a metal frame and a metal cover of the transceiver. Two sub-assemblies are electrically shielded by the partition plate, and the polygonal cross section of the subassembly makes the total width of the two assemblies added with the thickness of the partition plate minimum.