Transceiver Receptacle Assembly for AMC Shielding

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Solution Overview

Problem

There is a need for a cost-effective, low-profile connector receptacle assembly that complies with the Advanced Mezzanine Card (AMC) half-height card module standard to minimize space requirements for transceiver modules while providing shielding against electromagnetic interference in high-density networking applications.

Innovation Solution

A receptacle assembly featuring a transceiver cage with an outer and inner shell configuration that extends through a cutout in a circuit board, including a connector to mate with the transceiver module, and optionally using an adapter board for electrical connection, ensuring compliance with AMC standards and providing electromagnetic shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a traditional cage assembly is used, then electromagnetic shielding is provided, but the profile height is too large for AMC half-height card module standard

Engineering Contradiction:
Improveelectromagnetic interference shieldingVSAvoidcage assembly profile height
Core Design Contradiction:
Object-affected harmful factorsVSLength of moving object

Solution Approach 1:

The cage assembly is segmented into a first cage portion and a second cage portion, where the first cage portion provides electromagnetic shielding and the second cage portion provides structural support. This segmentation allows the shielding function to be achieved with reduced overall height while maintaining EMI protection effectiveness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from a traditional single-layer cage structure to a multi-layer stacked cage structure that utilizes vertical stacking to achieve shielding in a compressed height profile. The first and second cage portions are arranged in stacked relationship, effectively using the vertical dimension to maintain shielding performance while reducing the horizontal footprint and overall assembly height to comply with AMC half-height standards.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If transceiver density is increased, then port density improves, but space requirements for mounting transceiver modules increase

Engineering Contradiction:
Improvetransceiver port densityVSAvoidcircuit board mounting space
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The connector is nested within the cage assembly structure, with the connector housed inside the cage portions. This nesting arrangement allows the connector and cage to occupy overlapping spatial volumes, effectively reducing the total mounting space required on the circuit board while maintaining both shielding and electrical connection functions.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The invention merges the shielding function (cage assembly) with the electrical connection function (connector) into a single integrated assembly. By combining these previously separate components into one unified structure that mounts to the circuit board, the invention reduces the total mounting space required while maintaining both EMI protection and high-density transceiver integration capabilities.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS7452216B2Transceiver receptacle assembly
Publication Date: 2008.11.18 TE CONNECTIVITY SOLUTIONS GMBH
  • US7452216B2 patent drawing
  • US7452216B2 patent drawing
  • US7452216B2 patent drawing

AI summary

A receptacle assembly for a transceiver module includes a transceiver cage that is configured to receive the transceiver module. The transceiver cage is configured to be mounted proximate a cutout in a circuit board such that a portion of the transceiver cage extends through the cutout. A connector is configured to mate with the transceiver module and is disposed within the cage. The transceiver cage and the connector are configured to be mounted on the same surface of a circuit board.