Pluggable Transceiver Shell with Heat Spreader for Chip Cooling
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Solution Overview
Problem
Current pluggable transceiver modules in data centers are not optimized for effective heat transfer from semiconductor chips to heat sinks, leading to potential chip failure due to increased power consumption and heat dissipation as data throughput rises.
Innovation Solution
Incorporating heat spreaders such as heat pipes or vapor chambers within the module shells to enhance heat transfer across a larger area of the module shells, allowing for more efficient dissipation to heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If data throughput is increased in pluggable transceiver modules, then data processing capability is improved, but heat dissipation becomes insufficient leading to potential chip failure
Solution Approach 1:
The patent introduces a heat spreader as an intermediary component between the semiconductor chip and the heat sink. This heat spreader (which can be a heat pipe or vapor chamber) mediates the heat transfer process, absorbing heat from the chip and distributing it across a larger area for more effective dissipation, thereby maintaining chip reliability at high data throughput levels
Solution Approach 2:
The patent transitions from direct point-to-point heat transfer to distributed area-based heat transfer by introducing a heat spreader. This adds a spatial dimension to heat dissipation, spreading thermal energy across a larger surface area of the module shell rather than concentrating it at a single interface point
2Loss of energy
If heat spreaders are integrated into module shells, then heat transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat spreader functionality with the existing module shell structure. The heat spreader is integrated into the housing rather than being a separate external component, combining thermal management functions with the structural housing to minimize additional complexity while maximizing heat transfer efficiency
Solution Approach 2:
The module shell is designed to serve multiple functions: it provides structural housing, electrical shielding, and now also thermal management through the integrated heat spreader. This multi-functionality approach consolidates components and reduces overall device complexity despite adding advanced heat transfer capabilities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of heat spreaders significantly improves heat transfer efficiency from semiconductor chips to heat sinks, effectively managing heat dissipation and protecting the chips from failure in high-data-throughput environments.
Implementation Method 1
a heat spreader secured within the recessed area, between the upper shell and the semiconductor chip
Implementation Method 2
The heat spreader can be embodied as a heat pipe or a vapor chamber, among related types of heat spreaders
Data Source
AI summary
Aspects of heat exchange enhanced module shells for pluggable transceiver modules are described. In one example, a pluggable transceiver module includes a module shell. The module shell includes an upper shell and a lower shell. The upper shell includes a planar inner surface and a recessed area formed into the planar inner surface. The module also includes a printed circuit board, a chip mounted on the printed circuit board, and a heat spreader secured within the recessed area, between the upper shell and the chip. The heat spreader can be a heat pipe, a vapor chamber, or a related heat spreading structure. The heat spreader helps to transfer the heat from the chip across a larger area of the upper shell of the module. The heat can be more effectively transferred to a heat sink of a mating connector or cage for the pluggable transceiver module.