Optical Transceiver Module Stem Heat Sink Micro Heater
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Solution Overview
Problem
Existing optical transceiver modules face issues with wavelength shift due to ambient temperature changes, leading to communication failures in low-temperature environments, especially when using coarse wavelength division multiplexing (CWDM) schemes, and are limited by the length of RF transmission lines when operating at high frequencies.
Innovation Solution
The optical transceiver module employs a micro heater placed in a hole within the stem heat sink to compensate for temperature fluctuations of the laser diode chip, increasing the cross-sectional area of the stem for improved heat dissipation and electrically isolating pin leads from the stem and heat sink to reduce noise and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an auxiliary heater is positioned between the RF transmission line and PCB connection portion to maintain LD chip temperature, then wavelength stability is improved, but the length of the RF transmission line is limited when operating at high frequency
Solution Approach 1:
The heater is repositioned from a horizontal placement between the RF transmission line and PCB to a vertical placement within a hole in the stem heat sink. This dimensional change allows the heater to be positioned below the LD chip rather than beside it, freeing up horizontal space and enabling longer RF transmission lines without compromising temperature control capability
Solution Approach 2:
The heater is nested within a hole formed in the stem heat sink, placing it inside the existing thermal management structure. This nested configuration allows the heater to be integrated into the heat sink itself, eliminating the need for separate heater mounting space and allowing the RF transmission line to extend further without interference
2Stability of the object's composition
If pin leads are electrically connected to the stem and heat sink for structural support, then mechanical stability is improved, but electrical noise and channel interference increase
Solution Approach 1:
An insulating coating is applied to the pin leads that contact the stem and heat sink. This insulating layer acts as an intermediary that maintains the mechanical electrical connection for structural support while blocking the flow of electrical noise and interference signals, thus solving both the stability and noise issues simultaneously
Solution Approach 2:
The pin leads have different electrical properties at different locations: the portions requiring electrical connection remain conductive, while the portions contacting the stem and heat sink are coated with insulating material. This local differentiation of electrical properties allows the same component to serve both mechanical support and noise isolation functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents wavelength shift, reduces power consumption, enhances efficiency, and allows for longer high-frequency operation by shortening RF transmission lines, while minimizing electrical noise and ensuring reliable communication in low-temperature environments.
Implementation Method 1
putting a micro heater in a hole formed in a stem heat sink through a lower portion of a stem to compensate for the temperature of an LD chip
Implementation Method 2
since a portion of the stem heat sink is empty, the cross sectional area of the stem is increased and thus heat conduction efficiency is improved
Data Source
AI summary
Disclosed herein is a high speed optical transceiver module, which makes it possible to prevent a wavelength shift and thus to achieve low power and high efficiency by forming a hole with a predetermined depth in a stem heat sink for dissipating heat generated in an LD through a lower portion of a stem and putting a micro heater in the hole, thereby compensating for the temperature of the LD in order to prevent wavelength shift caused by the influence of the ambient temperature on an LD chip in a transistor outline (TO) when an un-cooled optical transceiver module is driven at low temperature and to prevent the communication from being impossible when the ambient temperature is lowered during the communication using a CWDM scheme.