Transceiver Switch Integration Reducing Chip Area and Insertion Loss
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional transceiver switches in integrated circuits for millimeter wave bands occupy large chip areas and have high insertion loss due to passive components like λ/4 transmission lines and inductors, affecting transmission efficiency and receiver sensitivity.
Innovation Solution
A transceiver apparatus with a switch configuration where the first metal connection line is disposed on the package substrate, reducing die area and insertion loss, and including power amplifiers and low noise amplifiers on the die, with switches and transformers to manage transmission and reception efficiently across different frequency bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive components like λ/4 transmission line or inductor are implemented through routing in die, then transceiver switch can be integrated on chip, but chip area occupied is large
Solution Approach 1:
The patent extracts the λ/4 transmission line from the die and relocates it to the package substrate. The transceiver switch remains integrated on the die, but the passive transmission line component is removed from the chip area and implemented as an off-chip routing structure, thereby reducing on-chip area occupation while maintaining integration benefits.
2Ease of manufacture
If passive components like inductor are implemented on chip, then transceiver switch can be integrated, but quality factor is low due to on-chip passive device characteristics
Solution Approach 1:
The patent extracts the λ/4 transmission line from the die and relocates it to the package substrate. This extraction removes the on-chip passive device that had low quality factor, replacing it with an off-chip implementation that achieves higher quality factor while the transceiver switch remains integrated on the die.
3Ease of manufacture
If passive components are implemented on chip, then transceiver switch can be integrated, but insertion loss is large affecting transmission efficiency and receiving sensitivity
Solution Approach 1:
The patent extracts the λ/4 transmission line from the die and relocates it to the package substrate. This extraction eliminates the source of high insertion loss associated with on-chip passive devices, thereby reducing overall insertion loss and improving both transmission efficiency and receiving sensitivity while maintaining switch integration.
Data Source
Figure 1
Figure 2(a)~2(b)
Figure 3(a)~3(b)
AI summary
This application relates to the field of electronic technologies, and provides a transceiver apparatus, a wireless communication apparatus, and a chipset, to reduce a chip area occupied by a transceiver switch and an insertion loss of the transceiver switch. The transceiver apparatus includes a package substrate and a die, and a transceiver switch is disposed in the apparatus. The transceiver switch includes an antenna feedpoint, a transmit feedpoint and a receive feedpoint that are coupled to the antenna feedpoint, and a first metal connection line that are disposed on the package substrate, and the antenna feedpoint and the receive feedpoint are disposed at two ends of the first metal connection line. The transceiver switch further includes a first switch, a transmit pad, and a receive pad that are disposed on the die, a first terminal of the first switch is coupled to the receive pad, a second terminal of the first switch is coupled to a ground terminal of the die, the receive pad is coupled to the receive feedpoint, and the transmit pad is coupled to the transmit feedpoint. A power amplifier PA and a low noise amplifier LNA are further disposed on the die, the transmit pad is coupled to an input terminal of the LNA, and the receive pad is coupled to an output terminal of the PA.