Optical Transceiver Module Thermal Bridge for PCB-Side Heat Dissipation
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Solution Overview
Problem
Electronic modules, particularly those with heat-producing components like VCSELs, laser drivers, and photo diodes, face challenges in dissipating heat from the side of the casing facing the PCB due to materials with low thermal conductivity, making it difficult to efficiently transfer heat away from the components, which can lead to deterioration or destruction.
Innovation Solution
A table-like heat dissipating element with legs is used to establish a thermal path from the heat-producing components to the casing, utilizing thermally conductive materials like aluminum or copper, and optionally a heat transfer medium to minimize thermal resistance and facilitate heat dissipation to the casing's inner surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the casing is made of material with low thermal conductivity to accommodate optical components, then the optical path is protected, but heat dissipation from the PCB side is insufficient
Solution Approach 1:
The heat dissipation function is segmented from the optical protection function. The casing is divided into an optical path area (with low thermal conductivity material for protection) and a heat dissipation area (with high thermal conductivity material or structure for heat removal). This allows each area to have optimized properties for its specific function without compromising the other.
Solution Approach 2:
A heat dissipation element is introduced as an intermediary component between the heat-generating electronic devices and the casing. This element acts as a thermal bridge, conducting heat from the PCB-mounted devices to the casing's outer surface, enabling heat dissipation without requiring the entire casing to have high thermal conductivity.
2Temperature
If heat dissipation means is mounted on the PCB or electronic device, then heat dissipation capability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The heat dissipation element is merged with the existing casing structure rather than being a separate mounted component. The casing itself is designed to serve dual functions: protecting the optical path and dissipating heat. This integration eliminates the need for additional heat sinks or cooling devices, reducing overall device complexity.
Solution Approach 2:
The casing is designed to perform multiple functions simultaneously: it provides mechanical protection for optical components, maintains the optical path, and serves as a heat dissipation structure. This multi-functionality reduces the total number of components needed and simplifies the overall module design.
3Temperature
If the PCB mounting surface area is increased to dissipate heat, then heat dissipation path is improved, but the module size increases
Solution Approach 1:
Heat dissipation is extended from the two-dimensional PCB surface into the third dimension by utilizing the casing's outer surface area. The heat dissipation element conducts heat vertically from the PCB through the casing thickness to the external environment, effectively using the casing's lateral surface area for heat dissipation without increasing the module's footprint.
Solution Approach 2:
The heat dissipation element acts as a thermal conductor that bridges the limited PCB mounting area and the extensive casing outer surface area. It concentrates heat from small device footprints on the PCB and distributes it across the larger casing surface, maximizing heat dissipation efficiency within the constrained module dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates over 80% of the heat generated by components like VCSELs, laser drivers, and photo diodes to the upper casing part, preventing component deterioration and ensuring efficient heat management.
Implementation Method 1
a table-like heat dissipating element (118) having one or more legs (118a) extending from a table top (118b) is provided on the mounting surface (104a) in such a way that the table top (118b) covers the at least one heat producing electronic device and the legs (118a) contact the mounting surface (104a) in an area surrounding the at least one heat producing electronic device
Implementation Method 2
a heat transfer medium is provided between the table top and the inner surface of the casing
Data Source
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AI summary
The invention relates to an electronic module, especially an optical transceiver module, comprising a casing (102), at least a portion of which (102b) consists of a thermally conductive material adapted to dissipate heat to the surrounding air or to a neighboring heat sink (heat dissipating portion); and a printed circuit board (104, 204) provided within the casing, the printed circuit board (104, 204) carrying at least one heat producing electronic device (112, 116) on a mounting surface (104a, 204a) thereof. According to the invention, a table-like heat dissipating element (118, 218, 318) having one or more legs (118a) extending from a table top (118b) is provided on the mounting surface (104a, 204a), wherein the table top (118b) covers the at least one heat producing electronic device (112, 116) and wherein the one or more legs (118a) contact the mounting surface (104a, 204a) in an area surrounding the at least one heat producing electronic device (112, 116). An upper surface of the table top (118b) either directly or indirectly contacts an inner surface of the heat dissipating portion of the casing (102).