Optical Transceiver Thermal Layout for High-Speed Heat Dissipation
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Solution Overview
Problem
As transmission speeds of optical transceivers increase, the amount of heat generated by components such as receiving and transmitting circuits has risen, necessitating improved cooling solutions.
Innovation Solution
An optical transceiver design incorporating a heat sink, heat conducting portions, and a heat pipe that transfers heat from these components to the sink efficiently, using thermal interface materials for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If transmission speed of optical transceiver is increased, then data transmission capability is improved, but heat generation from components increases
Solution Approach 1:
The heat dissipation system is segmented into multiple independent heat conducting portions, each thermally coupled to specific heat generating bodies. This allows targeted heat management for different components (receiving circuit, transmitting circuit, etc.) while maintaining high transmission speeds.
Solution Approach 2:
Heat conducting portions serve as intermediary elements between heat generating bodies and the heat sink. These portions are strategically positioned to conduct heat from various components to the heat sink, enabling effective heat dissipation without interfering with high-speed data transmission operations.
2Temperature
If heat dissipation is improved, then temperature of heat generating body is reduced, but device complexity increases
Solution Approach 1:
Multiple heat conducting portions are merged with the heat sink into an integrated heat dissipation system. This unified structure efficiently consolidates heat from multiple generating bodies while avoiding the complexity of separate cooling systems for each component.
Solution Approach 2:
The heat sink serves as a universal heat dissipation component that handles heat from multiple different heat generating bodies simultaneously. This multi-functional approach reduces overall system complexity compared to dedicated cooling solutions for each component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively lowers the temperature of heat-generating components by 13°C or more, promoting efficient heat dissipation and cooling of receiving and transmitting circuits.
Implementation Method 1
a heat pipe transferring heat that the heat conducting portion receives from the heat generating body to the heat sink
Implementation Method 2
heat conducting portion protruding from an inner wall surface of the case and in thermal contact with the heat generating body
Data Source
AI summary
An optical transceiver includes a case including a heat sink, one or more heat generating bodies disposed in the case, one or more heat conducting portions protruding from an inner wall surface of the case and thermally contacting the one or more heat generating bodies, and a heat pipe that transfers heat from the one or more heat conducting portions to the heat sink.