Electromechanical Transducer Acoustic Impedance Matching
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Solution Overview
Problem
Existing electromechanical transducer devices face noise issues due to low-frequency ultrasonic waves easily passing through the substrate and causing signal-to-noise ratio degradation, particularly in wide-band capacitive micromachined ultrasonic transducers, where conventional acoustic attenuating members are ineffective in reducing noise for frequencies lower than 2 MHz.
Innovation Solution
The implementation of a configuration with a first and second acoustic matching layer and an acoustic attenuating member on the back surface of the electric wiring substrate, which reduces reflection noise by matching acoustic impedances and absorbing ultrasonic waves, thereby improving the signal-to-noise ratio across a wider frequency band.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the distance between the substrate and electric wiring substrate is reduced for higher density array, then electrical connection is improved, but acoustic reflection noise from the back surface affects the electromechanical transducer elements
Solution Approach 1:
The second acoustic attenuating member (24) acts as an intermediary element placed on the back surface of the electric wiring substrate. This intermediary structure provides acoustic attenuation without requiring increased spacing between the substrate and electric wiring substrate, thus maintaining high transducer element density while still reducing acoustic reflection noise that would otherwise affect the electromechanical transducer elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces noise applied to the electromechanical transducer elements, enhancing the signal-to-noise ratio and improving the imaging precision in medical diagnostic applications by attenuating low-frequency ultrasonic waves and minimizing reflection noise.
Implementation Method 1
matching acoustic impedances and absorbing ultrasonic waves
Implementation Method 2
absorbing ultrasonic waves, thereby improving the signal-to-noise ratio
Data Source
AI summary
To suggest an electromechanical transducer device with a high S/N ratio, an electromechanical transducer device includes a first substrate; electromechanical transducer elements two-dimensionally arrayed on a front surface of the first substrate and configured to provide conversion between acoustic waves and electric signals; an electric wiring substrate that is a second substrate electrically connected with a back surface of the first substrate; a first acoustic matching layer provided between the first substrate and the second substrate; an acoustic attenuating member arranged on a back surface of the second substrate; and a second acoustic matching layer provided between the second substrate and the acoustic attenuating member.


