Ultrasonic Transducer Acoustic Separation Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Ultrasound reflections within the circuit board of an ultrasound transducer unit cause delays and noise in ultrasound images due to the propagation of ultrasound to the circuit board side, degrading image quality.
Innovation Solution
Incorporating a resonance layer with higher acoustic impedance than the piezoelectric element and an acoustic separation layer with lower acoustic impedance than the circuit board, creating a boundary where ultrasound is reflected and suppressed from propagating to the circuit board, with the acoustic separation layer potentially made of porous materials like porous carbon.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit board is placed adjacent to the piezoelectric element for compact design, then device compactness is improved, but ultrasound reflection noise increases due to ultrasound propagating to the circuit board
Solution Approach 1:
The patent introduces an acoustic separation layer as an intermediary substance between the piezoelectric element and the circuit board. This layer has acoustic impedance specifically designed to be lower than both the piezoelectric element and the circuit board, creating acoustic impedance mismatches at its boundaries that reflect ultrasound waves back toward the piezoelectric element before they can propagate into the circuit board and cause noise.
Solution Approach 2:
The patent changes the acoustic impedance parameter of the separation layer to be lower than both adjacent components (piezoelectric element and circuit board). This parameter change creates acoustic impedance mismatches at the boundaries, which reflect ultrasound waves and prevent them from propagating into the circuit board, thereby reducing noise while maintaining compact design.
2Reliability
If a resonance layer with high acoustic impedance is placed between the piezoelectric element and circuit board, then ultrasound transmission to living body is improved, but ultrasound propagation to circuit board is not sufficiently suppressed
Solution Approach 1:
The patent segments the acoustic separation function into two distinct layers: a resonance layer with high acoustic impedance that improves ultrasound transmission to the living body, and an acoustic separation layer with low acoustic impedance that suppresses ultrasound propagation to the circuit board. This segmentation allows each layer to perform its specific function optimally without compromising the other.
Solution Approach 2:
The patent uses parameter changes by setting the acoustic impedance of the separation layer to be lower than both the piezoelectric element and the circuit board, creating acoustic impedance mismatches that reflect ultrasound. This parameter optimization suppresses noise while the resonance layer maintains transmission efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces noise by minimizing ultrasound propagation to the circuit board, thereby enhancing the quality of ultrasound images by reducing reflections and improving image clarity.
Implementation Method 1
Due to the difference in the acoustic impedance between the resonance layer and the acoustic separation layer, the ultrasound may be reflected at a boundary surface between these layers, and, consequently, propagation of the ultrasound to the circuit board side can be suppressed.
Data Source
AI summary
A resonance layer (30) and an acoustic separation layer (34) are arranged adjacent to each other between a piezoelectric element (24) and a circuit board (16) provided with an electronic circuit for driving the piezoelectric element. The acoustic impedance of the resonance layer (30) is higher than that of the piezoelectric element (24), and the acoustic impedance of the acoustic separation layer (34) is lower than that of the circuit board (16). An ultrasonic wave is reflected at the interface between the resonance layer (30) and the acoustic separation layer (34) where the difference in acoustic impedance is large, and the ultrasonic wave propagating to the circuit-board (16) side is reduced.