Modular Transducer Array Interconnect Adaptor for Cross-Talk Reduction
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Solution Overview
Problem
Existing multidimensional transducer array interconnection technologies face challenges such as limited space for electrical connections, high trace density leading to electrical cross-talk, thermal conduction issues, and manufacturing difficulties due to tight tolerances and parasitic capacitance, which restrict the size and efficiency of assembled arrays.
Innovation Solution
A 90-degree adaptor is used to transition conductors from the transducer array to a printed circuit board, allowing for a pitch change and enabling the stacking of modules with standardized connections, while also incorporating thermal fins for heat removal and relaxing dimensional tolerances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flex circuit with high trace density is used to connect elements in a modular transducer array, then electrical connection is achieved, but electrical cross-talk increases and the size of arrays that can be practically assembled is limited
Solution Approach 1:
The patent transitions from planar surface traces to three-dimensional conductors routed through the thickness of the substrate. This vertical routing through vias and through-holes allows conductors to be separated in the depth dimension, reducing electromagnetic coupling and cross-talk while maintaining high connection density.
Solution Approach 2:
The patent introduces an intermediary substrate structure with embedded conductors that mediates between the transducer elements and the flex circuit. This substrate acts as a buffer that distributes and isolates electrical signals, reducing direct coupling between adjacent traces and minimizing cross-talk.
2Manufacturing precision
If the flatness of the laminated assembly is held to very high tolerance for precise module positioning, then assembly precision is improved, but manufacturing complexity and risk of failure increase
Solution Approach 1:
The patent incorporates compliance features such as flexible substrates, spring-loaded contacts, or tolerance-compensating mechanical structures that absorb flatness variations before they propagate to the electrical connections. This cushioning approach allows assembly within broader tolerance ranges while maintaining reliable electrical contact.
Solution Approach 2:
The patent changes the mechanical parameters of the assembly system by introducing compliant materials or adjustable positioning mechanisms. This allows the system to accommodate variations in flatness tolerance through material deformation or mechanical adjustment rather than requiring rigid precision.
3Reliability
If the flex circuit is used for interconnection, then electrical connection is achieved, but thermal conduction from the array is interrupted
Solution Approach 1:
The patent introduces a thermal intermediary structure, such as a thermally conductive substrate or heat spreader, that mediates between the transducer array and the flex circuit. This intermediary provides a dedicated thermal conduction path while allowing the flex circuit to maintain its electrical connection function without compromising heat transfer.
Solution Approach 2:
The patent merges the electrical and thermal conduction functions into a single integrated substrate structure. The substrate simultaneously provides electrical pathways for signal transmission and thermal pathways for heat dissipation, eliminating the interruption of thermal conduction that occurs with separate flex circuit layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient electrical connection, reduced cross-talk, improved thermal efficiency, and increased packing density, allowing for the assembly of larger arrays in a compact, handheld form while maintaining reliability and flexibility.
Implementation Method 1
conductors in the adaptor electrically connect with separate elements of the multidimensional transducer array and electrically connect with the printed circuit board
Implementation Method 2
An adaptor provides a 90-degrees or other non-zero angle transition of conductors from connection with the elements to connection with a printed circuit board
Implementation Method 3
The adaptor allows stacking of modules where each module uses standardized or regular printed circuit board connections and may provide a pitch change from the element pitch to a different pitch
Data Source
AI summary
An interconnect is provided for a multidimensional transducer array. An adaptor provides a 90-degrees or other non-zero angle transition of conductors from connection with the elements to connection with a printed circuit board. The adaptor is formed as a component that may surface mount on the printed circuit board and may provide a pitch change from the element pitch to a different pitch, such as a pitch of conductors of an integrated circuit also mounted to the printed circuit board. The adaptor allows stacking of modules where each module uses standardized or regular printed circuit board connections.