2D Ultrasound Transducer Array Conductive Matching Layer
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Solution Overview
Problem
The complexity of connecting transducer electrodes to control circuitry in two-dimensional ultrasound transducer arrays complicates array fabrication, especially due to difficulty in accessing interior elements, leading to inefficient electrical connections.
Innovation Solution
A simplified electrical connection architecture is implemented using a matching layer with an electrically conductive face as a common contact for transducer elements, where the matching layer is coupled to the second side of the transducer elements and diced to provide kerfs extending less than the conductive face, facilitating both electrical connection and acoustic isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual electrical connections are made to each transducer element in a 2D array, then electrical control of each element is achieved, but fabrication complexity increases significantly
Solution Approach 1:
Multiple individual electrical contacts on the second side of transducer elements are merged into a single common electrical contact through the conductive face of the matching layer. This consolidation maintains the ability to control each transducer element individually while dramatically simplifying the fabrication process by reducing the number of connection points from multiple individual contacts to a single common contact.
Solution Approach 2:
The conductive face of the matching layer serves multiple functions simultaneously: it provides acoustic impedance matching for ultrasonic wave transmission, acts as a common electrical contact for multiple transducer elements, and enables simplified fabrication. This multi-functionality resolves the contradiction by making the electrical connection system as universal as the acoustic matching requirement.
2Reliability
If a matching layer is added for acoustic impedance matching, then ultrasonic wave transmission is improved, but electrical connection complexity increases
Solution Approach 1:
The matching layer is designed to perform dual functions: acoustic impedance matching and electrical contact. The conductive face of the matching layer provides both acoustic coupling for improved ultrasonic transmission and electrical connectivity for simplified wiring. This eliminates the need for separate acoustic matching layers and complex electrical connection structures.
Solution Approach 2:
The acoustic matching function and electrical contact function are merged into a single component - the matching layer with its conductive face. This integration resolves the contradiction by combining what would traditionally be separate functional elements into one unified structure that achieves both acoustic and electrical objectives simultaneously.
3Object-generated harmful factors
If kerfs are extended through the entire matching layer, then acoustic isolation is improved, but electrical contact is interrupted
Solution Approach 1:
The kerfs are designed with non-uniform depth, extending only partially through the matching layer thickness rather than completely. This local variation in kerf depth provides sufficient acoustic isolation between adjacent transducer elements while preserving the continuity of the conductive face for electrical contact. The quality of the kerf changes locally from deep (for isolation) to shallow (for maintaining electrical contact).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the electrical connection process, reduces interference with ultrasonic wave transmission, and provides effective acoustic isolation, enhancing the fabrication and performance of two-dimensional ultrasound transducer arrays.
Implementation Method 1
Each transducer element can operate as an independent point source
Implementation Method 2
A matching layer is coupled to a second side of the transducer elements via an electrically conductive face
Implementation Method 3
The matching layer also comprises kerfs extending to a depth less than the electrically conductive face
Data Source
AI summary
In one aspect, an ultrasound transducer system comprises a two-dimensional array of transducer elements, the transducer elements having a first side comprising individual first electrodes in electrical communication with control circuitry of the ultrasound transducer system. A matching layer is coupled to a second side of the transducer elements via an electrically conductive face, wherein the electrically conductive face serves as a common electrical contact for the transducer elements. The matching layer also comprises kerfs extending to a depth less than the electrically conductive face.