Ultrasound Transducer Array Curved Groove Chipping Prevention
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Solution Overview
Problem
Conventional methods for forming curved ultrasound transducer arrays in ultrasound endoscopes face challenges such as chipping and reduced acoustic characteristics due to the formation of dividing grooves, which affect the integrity and performance of the transducer elements.
Innovation Solution
The solution involves creating a substrate with linear recesses and using a flexible film with lower fragility than the substrate, where the dividing groove is formed with a width smaller than the recess width, reaching from the substrate's surface to the flexible film, thereby reducing chipping and maintaining the integrity of the transducer elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If dividing grooves are formed in the c-MUT array to enable bending into a curved shape, then the transducer can be configured for radial or convex scanning, but chipping occurs and acoustic characteristics are reduced
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses in the substrate before creating the dividing grooves. These recesses are prepared in advance to receive and accommodate the grooves, preventing chipping during the groove formation process. The recesses are created using lithography and etching techniques before the dividing grooves are introduced, ensuring the substrate is pre-conditioned to handle the subsequent structural modifications without compromising transducer element integrity.
Solution Approach 2:
The patent introduces an intermediary structure - the recesses in the substrate - that mediates between the dividing grooves and the transducer elements. These recesses act as缓冲 zones that absorb the mechanical stress and prevent direct transmission of cutting forces to the transducer elements, thereby eliminating chipping while maintaining acoustic characteristics. The recesses serve as an intermediate buffer that protects the delicate transducer elements during the groove formation process.
2Shape
If the c-MUT array is bent to reduce the width of dividing grooves to form a curved shape, then the transducer section achieves the desired curved configuration, but the fragility of the substrate increases and chipping occurs
Solution Approach 1:
The substrate is pre-formed with recesses in the areas where dividing grooves will be created. This preliminary structuring of the substrate provides mechanical support and stress distribution zones before the bending and groove formation processes occur. The recesses are created through lithography patterns and etching, preparing the substrate to accommodate the subsequent structural changes without compromising strength.
Solution Approach 2:
The patent employs a flexible film structure that covers the c-MUT array and substrate assembly. This flexible film acts as a protective layer that maintains substrate integrity during bending operations. The film's flexibility allows the curved configuration to be achieved while its structural support prevents excessive stress concentration that would lead to chipping. The combination of the flexible film and pre-formed recesses creates a robust structure that can be bent without failure.
3Shape
If dividing grooves are formed to reach the flexible film to enable bending, then the curved shape is achieved, but the acoustic characteristics of transducer elements are degraded
Solution Approach 1:
The patent applies local quality by creating recesses only in specific locations where dividing grooves are needed, rather than uniformly across the entire substrate. The recesses are strategically positioned to provide local structural support and stress relief zones. This localized modification allows the dividing grooves to be formed without compromising the overall acoustic characteristics of the transducer elements, as the recesses are confined to non-critical areas that do not interfere with the acoustic performance of the active transducer regions.
Data Source
AI summary
An ultrasound transducer array according to an embodiment includes a substrate, a plurality of groove-like recesses arranged at a predetermined interval on one surface of the substrate, a cell region arranged between the recesses on the one surface side of the substrate, a flexible film configured to cover the substrate and the cell region and having fragility lower than fragility of the substrate, and a dividing groove having a width smaller than a width of the recess and reaching from the other surface of the substrate to the flexible film in the recess.