Large Area Transducer Array Tiling and 3D Integration
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Solution Overview
Problem
The existing technologies face challenges in manufacturing and maintaining large area transducers due to complexity and cost, and the need for extensive control and amplifier electronics, which results in long interconnect lengths and degraded signal quality.
Innovation Solution
The solution involves constructing large area transducer arrays by tiling smaller transducer elements on a substrate, with connectors on the backside for electrical coupling, and positioning electronic devices in close proximity to minimize interconnect lengths and enhance performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single large area transducer is manufactured, then the transducer can encompass the required large area, but the manufacturing complexity and cost become very significant
Solution Approach 1:
The patent divides a large area transducer into multiple smaller transducer elements that are tiled together to form the complete large area transducer array. This segmentation approach reduces the manufacturing complexity and cost by allowing each smaller element to be manufactured using standard technologies while achieving the required large total area through assembly of multiple elements.
2Ease of operation
If control and amplifier electronics are positioned in the X-Y plane with transducers, then the electronics can drive individual transducers, but the footprint increases and gaps appear in the transducer area
Solution Approach 1:
The patent positions the control and amplifier electronics in the Z-direction (vertical dimension) beneath the transducer elements rather than in the X-Y plane. This dimensional repositioning allows the electronics to be in close proximity to the transducer elements they drive, minimizing interconnect lengths while preserving the full transducer area in the X-Y plane without gaps.
3Reliability
If interconnect lengths are minimized by positioning electronics close to transducer elements, then signal quality improves, but the system requires three-dimensional arrangement which increases device complexity
Solution Approach 1:
The patent implements a three-dimensional arrangement where electronics are positioned in the Z-direction beneath the transducer elements in the X-Y plane. This dimensional organization minimizes interconnect lengths and improves signal quality while managing system complexity through structured spatial arrangement rather than random placement.
Solution Approach 2:
The patent introduces a substrate as an intermediary structure that supports both the transducer elements on its top surface and the electronics on its bottom surface. This intermediary substrate facilitates the three-dimensional arrangement, enabling close proximity coupling between electronics and transducers while providing mechanical support and electrical interconnection pathways.
4Ease of operation
If traditional interconnect strategies are used for high density I/O, then the transducers can be coupled with electronics, but the interconnect lengths become very long causing capacitance effects and signal degradation
Solution Approach 1:
The patent repositions the electronics from the X-Y plane to the Z-direction beneath the transducer elements. This dimensional change dramatically reduces the interconnect lengths required to couple high-density I/O between electronics and transducers, eliminating the long interconnect problems of traditional strategies and reducing capacitance effects and signal degradation.
Data Source
AI summary
A large area transducer array comprising a substrate having a front side and a backside, a plurality of transducers disposed on the front side of the substrate and patterned in the form of a two-dimensional transducer array in the X-Y plane, a plurality of connectors disposed on the backside of the substrate where the connectors are electrically coupled to the transducer elements. Further, a stacked transducer array comprising an electronic device disposed in a first layer, a substrate including a front side and a backside, an electrical interconnect layer disposed on the substrate and a plurality of transducers disposed in a third layer where the transducers are electrically coupled to the electronic device disposed in the first layer.