Ultrasound Probe Transducer Assembly Mass Production
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Solution Overview
Problem
The challenge lies in creating compact ultrasound probe transducer assemblies that can be produced efficiently and with high repeatability, particularly as the size of ultrasound probes decreases, while maintaining effective production methodologies.
Innovation Solution
The solution involves a transducer assembly comprising piezoelectric material with a backing material and electrically conductive material on the side surface, forming electrically conductive pathways for grounding or signaling, and a method for mass production that includes interconnecting and separating layers to define electrodes and pathways, allowing for compact and efficient assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of ultrasound probes decreases to achieve compactness, then the portability and applicability improve, but the production repeatability and manufacturing efficiency deteriorate
Solution Approach 1:
The patent combines multiple functional layers (piezoelectric material, backing material, electrically conductive material) into an integrated assembly that can be manufactured as a single unit. This merging of components enables compact probe design while maintaining production repeatability through standardized multi-layer fabrication processes.
Solution Approach 2:
The patent utilizes three-dimensional stacking of functional layers to achieve compact probe geometry. By arranging piezoelectric elements, backing materials, and conductive pathways in vertical layers rather than horizontal arrangements, the probe achieves compactness while maintaining manufacturability through layered processing techniques.
2Volume of moving object
If the size of ultrasound probes decreases to achieve compactness, then the portability and applicability improve, but the production efficiency deteriorates
Solution Approach 1:
The patent incorporates electrically conductive pathways and grounding structures during the initial formation of the piezoelectric material layers, rather than adding them as separate subsequent steps. This preliminary integration of conductive elements enables compact probe design while maintaining high production efficiency through reduced assembly steps.
Solution Approach 2:
The patent merges the functions of electrical grounding, signal transmission, and structural support into integrated layers that are formed simultaneously with the piezoelectric material. This combination of functions reduces the number of separate manufacturing steps, thereby improving production efficiency despite compact probe dimensions.
3Ease of manufacture
If electrically conductive material is disposed on the side surface to define pathways, then the compactness and producibility improve, but the structural complexity increases
Solution Approach 1:
The patent positions electrically conductive material on the lateral surfaces of the piezoelectric elements, utilizing the side surfaces rather than top or bottom surfaces. This dimensional arrangement creates compact vertical pathways that simplify the overall structure while maintaining electrical functionality and manufacturability.
Solution Approach 2:
The side surface conductive material serves multiple functions simultaneously: it provides electrical pathways for signal transmission, acts as grounding structures, and defines the geometric boundaries of the piezoelectric elements. This multi-functionality reduces structural complexity by eliminating the need for separate components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in compact, efficiently producible ultrasound probe transducer assemblies with enhanced production repeatability and scalability, facilitating the creation of multiple assemblies through mass processing techniques.
Implementation Method 1
a plurality of elements comprising piezoelectric material
Implementation Method 2
a backing material adjacent to the back surface of the plurality of elements
Data Source
AI summary
An improved ultrasound transducer assembly, e.g. a thickness-mode transducer assembly includes a plurality of elements comprising piezoelectric material, and a backing material disposed adjacent to a back surface of the plurality of elements. The piezoelectric material and backing material define at least a portion of a side surface, wherein an electrically conductive material is disposed upon and in contact with at least a portion of the side surface. The elements may comprise one or a plurality of front electrodes, and one or a plurality of back electrodes, wherein the front electrode(s) is electrically interconnected to the electrically conductive material disposed on the side surface portion. In a mass processing method, a plurality of thickness-mode ultrasound probe transducer assemblies may be produced, wherein a plurality of interconnected transducer subassemblies comprising a mass backing are processed in tandem.