Harsh Environment Transducer Bond Frame Isolation
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Solution Overview
Problem
Transducers, such as sensors and actuators, face challenges in withstanding harsh environments characterized by high temperatures and corrosive conditions, particularly in applications like turbine or engine combustion zones, where they are susceptible to damage due to their materials and require additional protection for both the transducer elements and electrical connections.
Innovation Solution
A transducer design that includes a substrate with a bond frame isolating electrical connections from the harsh environment, using materials that match the bond frame for both the connecting component and sensing element, and a method for forming a semiconductor-on-insulator wafer with piezoelectric or piezoresistive films, ensuring mechanical and electrical coupling while protecting against environmental factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a transducer is placed in a harsh environment (high temperature, corrosive conditions), then it can perform measurements in critical zones (e.g., combustion chamber), but the transducer materials and electrical connections become susceptible to damage
Solution Approach 1:
The transducer system is divided into separate functional components: the sensing element on the die, the bond frame structure, and the electrical connections. This segmentation allows each component to be optimized for its specific function and protected appropriately, with the bond frame serving as a protective barrier between the sensitive electrical connections and the harsh environment
Solution Approach 2:
The bond frame acts as an intermediary component between the transducer die and the external environment. It provides mechanical support and electrical connectivity while physically isolating the sensitive electrical connections from direct exposure to harsh conditions, thereby mediating between the need for environmental access and protection
2Reliability
If additional protection is added to protect electrical connections from harsh environments, then reliability improves, but device complexity increases
Solution Approach 1:
The bond frame is designed to perform multiple functions simultaneously: it provides mechanical support for the transducer die, establishes electrical connectivity through the substrate, and serves as a protective barrier against environmental damage. This multi-functionality reduces the need for separate protective components, thereby limiting the increase in device complexity while maintaining improved reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects transducer elements and connections from harsh environments, enabling reliable operation in high-temperature, high-pressure conditions with improved durability and sensitivity to pressure fluctuations.
Implementation Method 1
a piezoelectric or piezoresistive sensing element at least partially located on the diaphragm such that the sensing element provides an electrical signal upon flexure of the diaphragm
Implementation Method 2
a piezoelectric or piezoresistive sensing element at least partially located on the diaphragm such that the sensing element provides an electrical signal upon flexure of the diaphragm
Data Source
AI summary
A pressure sensor for use in a harsh environment including a substrate and a sensor die directly coupled to the substrate by a bond frame positioned between the substrate and the sensor die. The sensor die includes a generally flexible diaphragm configured to flex when exposed to a sufficient differential pressure thereacross. The sensor further includes a piezoelectric or piezoresistive sensing element at least partially located on the diaphragm such that the sensing element provides an electrical signal upon flexure of the diaphragm. The sensor also includes an connecting component electrically coupled to the sensing element at a connection location that is fluidly isolated from the diaphragm by the bond frame. The bond frame is made of materials and the connecting component is electrically coupled to the sensing element by the same materials of the bond frame.