Ultrasonic Transducer Buffer Member for Yield and Accuracy
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Solution Overview
Problem
Manufacturing ultrasonic transducers with a multi-channel capacity and large area faces challenges due to low manufacturing yield, requiring multiple transducer modules arranged on a substrate, which complicates the process and reduces accuracy.
Innovation Solution
The use of a substrate with loaded transducer modules, adhesive parts, and a buffer member made of polymer-based materials to support and buffer the transducer chips, reducing movement and deformation during operation, and enhancing accuracy by arranging transducers in an m×n array configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If multiple transducer modules are arranged on a substrate to achieve multi-channel capacity and large area, then the transducer's channel capacity and coverage area are improved, but the manufacturing yield deteriorates and process complexity increases
Solution Approach 1:
The transducer array is divided into multiple independent transducer modules, each containing a subset of transducer elements. These modules are separately manufactured and then assembled on the substrate, allowing individual module testing and replacement without affecting the entire array, thus improving manufacturing yield while achieving large area coverage
Solution Approach 2:
A buffer member made of polymer-based material is introduced as an intermediary component between the transducer modules and the substrate. This buffer member absorbs thermal expansion differences and mechanical stresses, preventing deformation of the transducer elements during manufacturing and operation, thereby improving both manufacturing yield and operational reliability
2Adaptability or versatility
If multiple transducer modules are arranged on a substrate to achieve multi-channel capacity, then the transducer's channel capacity is improved, but the device complexity increases
Solution Approach 1:
The substrate is designed with universal features including a standardized buffer member structure that serves multiple functions: mechanical support, thermal management, and stress absorption. The driver chips are configured to control multiple transducer modules through standardized interfaces, reducing the complexity of managing multiple channels while maintaining high adaptability
3Adaptability or versatility
If transducer modules are arranged on a substrate, then the transducer's multi-channel capacity is achieved, but the accuracy of ultrasonic wave transmission deteriorates due to deformation and movement
Solution Approach 1:
The buffer member is pre-installed on the substrate before mounting the transducer modules. This buffer member is specifically designed to compensate for thermal expansion and mechanical stresses that will occur during operation, providing beforehand cushioning that prevents deformation of transducer elements and maintains positioning accuracy throughout the device's lifecycle
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the accuracy and stability of ultrasonic wave transmission and reception by reducing deformation and movement of transducer chips, leading to higher manufacturing yield and better image resolution.
Implementation Method 1
the buffer member may include at least one polymer-based material
Data Source
AI summary
An ultrasonic transducer includes a plurality of transducer modules, a substrate on which each of the plurality of transducer modules is arranged, and a buffer member which buffers the movements of the upper portions of the transducer modules, wherein the buffer member is disposed on the substrate between the plurality of transducer modules and on the substrate outside of the plurality of transducer modules.