Ultrasound Transducer Variable Thickness Dematching Layer
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Solution Overview
Problem
Conventional ultrasound transducers face challenges in achieving a broad bandwidth due to the difficulty and expense of manufacturing piezoelectric materials with multiple thicknesses required for optimal frequency response, leading to limitations in sensitivity and impedance matching.
Innovation Solution
The use of a dematching layer with varying thickness, having a higher acoustic impedance than the acoustic layer, which alters the bandwidth of the ultrasound transducer by shaping the backside to define a concave surface, allowing for a broader frequency range without the need for multiple thicknesses in the piezoelectric material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If piezoelectric materials are machined to have multiple thicknesses to achieve broader bandwidth, then the frequency response range is improved, but the manufacturing difficulty and cost increase significantly
Solution Approach 1:
The patent divides the acoustic layer into multiple discrete elements with different thicknesses rather than machining a single continuous piezoelectric material. Each element can be independently manufactured at standard thicknesses and then assembled together, avoiding the need for complex precision machining of the piezoelectric material itself while achieving the desired multi-frequency response
Solution Approach 2:
Instead of varying thickness within a single piezoelectric layer (one-dimensional variation), the patent uses multiple separate elements stacked or arranged in space (adding a spatial dimension). This allows different frequency responses to be achieved through element selection and arrangement rather than through complex thickness variations in a single material layer
2Adaptability or versatility
If piezoelectric materials are machined to have multiple thicknesses to achieve broader bandwidth, then the overall frequency range is improved, but the manufacturing cost increases
Solution Approach 1:
The acoustic layer is segmented into multiple independent elements that can be manufactured using standard, cost-effective processes. Rather than requiring expensive precision machining of a single piezoelectric block, each element can be produced at standard thicknesses and then assembled, significantly reducing manufacturing costs while maintaining the multi-frequency capability
Solution Approach 2:
The patent uses multiple copies of standard-thickness piezoelectric elements rather than creating a custom-machined piece. These replicated standard elements are then arranged in specific configurations to achieve the desired bandwidth, leveraging economies of scale from standardized manufacturing processes
3Manufacturing precision
If a thinner acoustic layer is used to achieve the same resonant frequency, then the electrical impedance match with the imaging system is improved, but the sensitivity decreases
Solution Approach 1:
The patent applies local quality by having different elements with different thicknesses in specific locations within the acoustic layer. Thinner elements provide good impedance matching for higher frequencies, while thicker elements provide sensitivity for lower frequencies. This spatial variation in element properties allows simultaneous optimization of both impedance matching and sensitivity across the bandwidth
Solution Approach 2:
The acoustic layer functions as a composite structure combining multiple piezoelectric elements with different thicknesses and potentially different material properties. This composite approach allows the layer to exhibit a range of resonant frequencies and impedance characteristics, enabling both good electrical matching and high sensitivity across a broad frequency range
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a transducer with increased bandwidth, improving sensitivity and impedance matching, and is more cost-effective and easier to manufacture than machining piezoelectric materials with different thicknesses.
Implementation Method 1
The acoustic layer may include a plurality of transducer elements. The transducer and ultrasound imaging system include a dematching layer having a thickness that varies in order to alter a bandwidth of the ultrasound transducer
Implementation Method 2
The dematching layer typically includes a material with a higher acoustic impedance than the acoustic layer. Using a dematching layer enables the ultrasound transducer to use a thinner acoustic layer to achieve the same resonant frequency
Data Source
AI summary
An ultrasound transducer and an ultrasound imaging system including an acoustic layer with a plurality of transducer elements and a dematching layer coupled to the acoustic layer. The dematching layer has an acoustic impedance greater than the acoustic layer and the dematching layer has a thickness that varies in order to alter a bandwidth of the ultrasound probe.