Ultrasonic Transducer Electrode Step Moderation

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Solution Overview

Problem

Conventional ultrasonic transducers using piezoelectric materials face challenges with increased resistance, membrane damage, and decreased dielectric strength due to the thickness of lower electrodes and interconnections, particularly when forming arrays, which affects the reliability and stability of the device.

Innovation Solution

The ultrasonic transducer design includes a first electrode, insulation films, and interconnections where the width of interconnections overlapping the edge of the electrode is thicker than those not overlapping, and the step of the electrode is moderated by tapering or forming sidewalls, reducing the resistance increase and maintaining dielectric strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the lower electrode thickness is increased to reduce resistance, then the resistance decreases, but the step of the electrode increases causing interconnection coverage problems and membrane damage

Engineering Contradiction:
Improveresistance stabilityVSAvoidelectrode step
Core Design Contradiction:
ReliabilityVSShape

Solution Approach 1:

The patent applies local quality by making the interconnection width variable along its length. Specifically, the interconnection has a first width when overlapping the lower electrode edge and a second width (greater than the first width) when not overlapping the edge. This localized width increase compensates for the reduced coverage at the electrode step, ensuring adequate electrical connection without increasing the electrode thickness.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the geometric parameter of the interconnection (its width) to resolve the contradiction. By increasing the interconnection width in specific regions, the patent compensates for the step effect caused by thick lower electrodes, thereby maintaining both low resistance and adequate coverage without modifying the electrode thickness itself.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the interconnection width is increased to reduce resistance, then the resistance decreases, but the device complexity increases

Engineering Contradiction:
Improveresistance stabilityVSAvoidinterconnection structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Instead of uniformly increasing the interconnection width throughout, the patent applies local quality by making the width increase only in specific regions where needed (where the interconnection does not overlap the lower electrode edge). This localized approach reduces resistance effectively while minimizing the overall increase in device complexity and material usage.

Inventive Principle:
Principle #3Local quality

3Manufacturing precision

If the lower electrode step is moderated to reduce interconnection issues, then the manufacturing precision improves, but the electrode thickness must be reduced increasing resistance

Engineering Contradiction:
Improveinterconnection alignmentVSAvoidresistance stability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent changes the parameter of the interconnection (its width) to compensate for the fixed electrode step. Rather than reducing the electrode thickness to improve manufacturing precision, the patent maintains the thick electrode for low resistance and instead adjusts the interconnection width parameter to ensure proper coverage and alignment, thereby resolving both issues simultaneously.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design suppresses resistance increase, reduces membrane damage, and enhances the reliability of the ultrasonic transducer by maintaining dielectric strength and stability, even when emitting strong ultrasonic waves.

Implementation Method 1

ultrasonic transducers using piezoelectric vibration

Methodology Applied
Scientific EffectPiezoelectric vibration: Piezoelectric Effect

Implementation Method 2

wet etching holes for forming the hollow parts

Methodology Applied
Scientific EffectWet etching:

Data Source

PatentUS8754489B2Ultrasonic transducer and manufacturing method
Publication Date: 2014.06.17 FUJIFILM CORP
  • US8754489B2 patent drawing
  • US8754489B2 patent drawing
  • US8754489B2 patent drawing

AI summary

An ultrasonic transducer includes a first electrode, a first insulation film covering the first electrode, a hollow part overlapping the first electrode on the first insulation film, a second insulation film covering the hollow part, a second electrode overlapping the hollow part on the second insulation film, and an interconnection joined to the second electrode. An edge of the first electrode is formed so as to moderate a step of the first electrode.