Eutectic-Bonded Transducer Structure to Contain AlGe Scattering
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Solution Overview
Problem
Existing transducers face issues with bonding materials like AlGe eutectic spreading or scattering during heat treatment, leading to potential malfunction and reduced reliability.
Innovation Solution
A transducer design featuring a metal eutectic layer with a recess in the second substrate, surrounded by an insulating layer, which prevents the eutectic material from scattering and ensures reliable bonding between the first and second substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If AlGe eutectic bonding material is used to bond the base body and lid, then bonding strength is improved, but the eutectic material may spread or scatter during heat treatment reducing reliability
Solution Approach 1:
The patent introduces an insulating layer as an intermediary substance between the AlGe eutectic bonding material and the functional element. This insulating layer acts as a barrier that prevents the eutectic material from directly contacting and potentially damaging the functional element during heat treatment, while still allowing the bonding process to proceed effectively
Solution Approach 2:
The patent acknowledges that heat treatment is necessary for forming the eutectic bonding material, but this same heat treatment causes the eutectic material to spread or scatter. By introducing the insulating layer, the patent converts the potentially harmful spreading effect into a beneficial configuration where the eutectic material is contained in a controlled manner, ensuring reliable bonding without damaging the functional element
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances bonding strength and reliability by containing the eutectic material within the recess, preventing scattering and maintaining the integrity of the transducer's functionality.
Implementation Method 1
a metal eutectic layer that bonds the first substrate and the second substrate to each other in a bonding region
Implementation Method 2
the insulating layer including a first portion provided on the first surface, a second portion provided on the side wall, and a third portion provided on the second surface is provided, and the insulating layer is provided on both sides of the bonding region
Data Source
AI summary
A transducer includes a first substrate; a second substrate that is disposed to overlap the first substrate and is provided with an insulating layer on a surface of the second substrate; a functional element provided between the first substrate and the second substrate; and a metal eutectic layer that bonds the first substrate and the second substrate to each other in a bonding region positioned around the functional element, in which a recess is provided in a first surface of the second substrate on the first substrate side, the recess is configured with a second surface that is a bottom, and a side wall that connects the first surface and the second surface, the insulating layer includes a first portion provided on the first surface, a second portion provided on the side wall, and a third portion provided on the second surface, and the bonding region is disposed between the second portions when viewed in plan in a Y axis direction along a Y axis.