Ultrasonic Transducer Groove Conductive Path
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Solution Overview
Problem
The manufacturing process of ultrasonic transducers is complicated, leading to high costs and alignment difficulties due to the need for precise formation of through holes and overlapping conductive films in the acoustic matching layer, which increases the risk of errors and prolongs the manufacturing time.
Innovation Solution
The ultrasonic transducer design incorporates first and second grooves in the non-conductive acoustic matching layer, allowing for a conductive path to be formed without the need for complex overlapping of conductive films, with the grooves intersecting to create a through hole and using a conductive film to ensure electrical conductivity between the electrode and the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are formed in the non-conductive acoustic matching layer to provide conductive paths, then electrical connection between piezoelectrics and FPC is achieved, but manufacturing complexity increases due to precise alignment requirements and multiple processing steps
Solution Approach 1:
The acoustic matching layer is divided into multiple segments (first acoustic matching layer, second acoustic matching layer, third acoustic matching layer) with each segment containing specific through holes. This segmentation allows independent formation and connection of conductive paths in each layer, reducing the complexity of forming a single complex through-hole structure while ensuring reliable electrical connection from piezoelectrics to FPC.
2Reliability
If multiple acoustic matching layers with different acoustic impedances are used to reduce acoustic mismatching, then ultrasonic wave propagation efficiency is improved, but manufacturing complexity and alignment difficulty increase
Solution Approach 1:
The acoustic matching layer is segmented into multiple layers (first, second, and third acoustic matching layers) with progressively decreasing acoustic impedances (15-30 Mrayl, 6-12 Mrayl, and 3-6 Mrayl respectively). Each layer contains specific through holes that align vertically to form continuous conductive paths. This segmentation approach enables gradual acoustic impedance matching while the vertical alignment of through holes across layers provides straightforward manufacturing guidance, reducing alignment complexity.
Solution Approach 2:
The invention transitions from a single-plane conductive path formation to a multi-layered three-dimensional structure. Through holes are formed vertically through multiple acoustic matching layers, creating conductive paths in the depth dimension. This dimensional approach allows electrical connection to be achieved through simple vertical alignment rather than complex lateral positioning, significantly reducing manufacturing precision requirements.
3Ease of manufacture
If conventional methods with conductive films on both surfaces of non-conductive boards are used, then conductive paths are provided, but manufacturing time and costs increase due to complicated overlapping processes
Solution Approach 1:
The invention extracts the conductive path formation process from the complex overlapping of conductive films on both surfaces of non-conductive boards. Instead, conductive paths are formed by creating through holes directly in the acoustic matching layers and filling them with conductive material. This extraction simplifies the manufacturing process to a single integrated structure formation rather than multiple film overlapping steps, significantly reducing manufacturing time and cost.
Solution Approach 2:
The invention merges the acoustic matching function and the electrical connection function into a single integrated structure. The acoustic matching layers themselves contain the through holes that form conductive paths, eliminating the need for separate conductive films and their complex overlapping processes. This merging of functions into one structure simplifies manufacturing while ensuring both acoustic performance and electrical connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This simplifies the manufacturing process, reduces costs, and ensures a reliable conductive path between the electrode and the substrate, improving the efficiency and accuracy of the ultrasonic transducer assembly.
Implementation Method 1
An ultrasonic probe comprises a plurality of piezoelectrics... In order to transmit ultrasonic waves, a driving voltage must be applied to the piezoelectrics... when receiving ultrasonic waves, the received signals must be extracted from the piezoelectrics
Implementation Method 2
the acoustic impedance of body tissues is approximately 1.5 Mrayl... the acoustic impedance of piezoelectrics is 30 Mrayl or more... acoustic mismatching occurs when body tissues are directly contacted to piezoelectrics... an acoustic matching layer is necessary between body tissues and piezoelectrics
Data Source
AI summary
The purpose is to provide an ultrasonic transducer and ultrasonic probe without the complexity of the manufacturing process of a non-conductive acoustic matching layer while ensuring the conductive path. In the non-conductive acoustic matching layer comprising the first surface of the electrode side and the second surface of the opposite side of the piezoelectrics, a plurality of first grooves leading up to the mid-way point between the first surface and the second surface are arranged on each of the first surfaces of the non-conductive acoustic matching later in response to the arrangement of sound elements. Moreover, each of the second surfaces is provided with the plurality of second grooves leading up to at least the mid-way point from the second surface, intersecting the first grooves.