Ultrasonic Transducer Insulating Layer Crosstalk Reduction
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Solution Overview
Problem
Current ultrasonic transducer manufacturing methods face challenges in achieving improved insulation characteristics and simplified assembling structures, which affect the accuracy and safety of ultrasound measurements.
Innovation Solution
The proposed solution involves an ultrasonic transducer module with a substrate, thin film, support portion, and electrode pads, where the electrode pads are attached using direct bonding or flip chip bonding, and an insulating layer is used to enhance insulation, along with an adhesive layer that can include sound-absorbing materials to reduce crosstalk and frequency distortions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional manufacturing methods are used, then the assembling structure is complex and insulation characteristics are insufficient, but the manufacturing process is simpler
Solution Approach 1:
The patent merges the substrate and support portion into a single integrated component, eliminating the need for separate assembly steps. This integration simplifies the overall assembling structure while maintaining adequate insulation through the substrate material itself, resolving the contradiction between complex assembly and insufficient insulation.
Solution Approach 2:
The patent introduces an insulating layer as an intermediary component between conductive elements. This insulating layer provides the necessary electrical insulation characteristics without requiring complex multi-layer assembling structures, thus improving reliability while keeping the device structure relatively simple.
2Reliability
If electrode pads are attached using traditional bonding methods, then assembly is easier, but electrical crosstalk and short-circuiting risks increase
Solution Approach 1:
The patent uses an insulating layer as an intermediary between electrode pads and underlying structures. This intermediary layer prevents electrical crosstalk and short-circuiting while allowing the electrode pads to be attached using standard bonding processes, thus maintaining ease of manufacture while improving electrical insulation reliability.
Solution Approach 2:
The patent applies insulating material specifically at critical locations where electrical isolation is needed, rather than requiring complete structural redesign. This localized approach to electrical insulation maintains the overall simplicity of the bonding process while preventing crosstalk and short-circuiting at specific high-risk areas.
3Ease of manufacture
If the thin film effective region is reduced to simplify assembly, then manufacturing becomes easier, but transducer performance deteriorates
Solution Approach 1:
The patent combines the support function and electrical connection function into the integrated substrate structure. This merger eliminates the need for separate support components that would otherwise require precise alignment and reduce the thin film effective region, thereby maintaining manufacturing precision while simplifying the assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves insulation characteristics, reduces electrical crosstalk, maintains the effective region of the thin film, and ensures safe operation by preventing short-circuiting and frequency distortions, thereby enhancing the accuracy and safety of ultrasound measurements.
Implementation Method 1
Ultrasonic transducers such as micromachined ultrasonic transducers (MUTs) may convert electrical signals into ultrasound signals and vice versa. Among the MUTs, the cMUTs may be mostly used. A cMUT may transmit and receive ultrasound waves by using a displacement difference between hundreds or thousands of micromachined diaphragms.
Implementation Method 2
The Si wafer, the thin film, and the cavity may form a capacitor. When an alternating current (AC) flows through the capacitor, the thin film may vibrate, and the vibration may generate ultrasonic waves.
Implementation Method 3
an adhesive layer between the substrate and the first electrode layers. the adhesive layer may comprise sound absorbing material
Data Source
AI summary
An ultrasonic transducer module may comprise: an ultrasonic transducer comprising a substrate, a thin film separated from the substrate, a support portion for supporting the thin film, and a first electrode pad on the substrate; and/or a circuit board comprising a main body, an opening in the main body for accommodating the thin film, and a second electrode pad attached to the first electrode pad. An ultrasonic transducer may comprise: a substrate; a plurality of first electrode layers on the substrate, with spaces between the first electrode layers; an insulating layer between the substrate and the first electrode layers; a support portion on the first electrode layers; a thin film supported by the support portion, with cavities between each of the first electrode layers and the thin film; and/or a second electrode layer on the thin film.