Ultrasonic Transducer Matching Layer Grooves for Acoustic Impedance
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Solution Overview
Problem
Conventional ultrasonic transducers have suboptimal acoustic impedance, leading to unsatisfactory vibration isolation and high-energy ring-down pulses, which reduce ultrasonic image resolution.
Innovation Solution
A waveform improvement method and ultrasonic transducer design that incorporates a piezoelectric material coupled with a matching material featuring grooves in the matching layer to optimize acoustic impedance and vibration isolation, using an isolation material within these grooves and applying opposite polarities of voltage to generate ultrasonic signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If matching layers are formed by stacking corresponding materials in conventional ultrasonic transducers, then the acoustic impedance can be adjusted, but the vibration isolation effect is not satisfactory and the acoustic impedance is not optimized
Solution Approach 1:
The patent introduces a porous matching layer with controlled porosity (30-70%) to optimize acoustic impedance matching. The porous structure provides both impedance optimization and vibration isolation by creating a gradient structure that gradually transitions acoustic impedance between the piezoelectric element and the medium, while the porous nature dampens vibrations effectively.
Solution Approach 2:
The patent uses composite matching layers combining multiple materials with different acoustic properties. The composite structure includes a first matching layer and a second matching layer with different material compositions, creating a gradient impedance profile that optimizes both acoustic transmission and vibration isolation without requiring complex stacked structures.
2Ease of manufacture
If conventional matching layers are used, then the structure is simple, but the acoustic impedance is not optimized leading to high-energy ring down pulse
Solution Approach 1:
The patent optimizes the acoustic impedance by changing physical parameters of the matching layer including porosity (30-70%), thickness ratios, and material composition. These parameter changes create a gradient impedance structure that reduces ring-down pulse energy by optimizing the acoustic transition, while maintaining manufacturability through conventional ceramic processing techniques.
Solution Approach 2:
The patent divides the matching layer into multiple segments or layers with progressively changing properties. The first matching layer and second matching layer are segmented with different acoustic impedances, creating a gradual transition that reduces harmful ring-down pulses while keeping each segment manufacturable using standard processes.
3Manufacturing precision
If the acoustic impedance is not optimized, then the manufacturing process is simple, but the ultrasonic image resolution is reduced
Solution Approach 1:
The porous matching layer structure achieves precise acoustic impedance control through controlled porosity (30-70%), which can be adjusted during manufacturing to optimize image resolution. The porous structure provides a gradient impedance profile that improves ultrasonic transmission and reduces artifacts, while being manufacturable through conventional sintering processes with controlled atmosphere.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optimized acoustic impedance and vibration isolation reduce ring-down pulse amplitudes and harmonic noise, resulting in improved ultrasonic signal waveforms and increased image resolution.
Implementation Method 1
the piezoelectric material comprises at least one piezoelectric layer... providing two input voltages to the piezoelectric material for generating an ultrasonic signal by the piezoelectric material
Implementation Method 2
The matching material is configured to match acoustic impedance of the piezoelectric material. The plurality of first grooves in the matching layer are configured to optimize the acoustic impedance
Implementation Method 3
packaging an isolation material into the plurality of first grooves... The plurality of first grooves in the matching layer are configured to optimize the acoustic impedance and a vibration isolation effect
Data Source
AI summary
A waveform improvement method includes providing a piezoelectric material coupled to a matching material, generating a plurality of first grooves in a matching layer of at least one matching layer, packaging an isolation material into the plurality of first grooves, and providing two input voltages to the piezoelectric material for generating an ultrasonic signal by the piezoelectric material. The piezoelectric material includes at least one piezoelectric layer. The matching material includes at least one matching layer. The matching material is used to match acoustic impedance of the piezoelectric material. The plurality of first grooves in the matching layer are used to optimize the acoustic impedance and a vibration isolation effect.