Transducer Holding Module for Compact ANC Earphones

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Solution Overview

Problem

In-ear earphones face challenges in optimizing the placement of feedback microphones for active noise cancellation (ANC) due to space constraints, especially when additional sensors are present, which can compromise sound quality and housing size.

Innovation Solution

A transducer holding module with distinct receptacles for sound transducers on different sides and multiple openings for acoustic connection, allowing the feedback microphone to be positioned in the back volume while maintaining compactness and sound quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the feedback microphone is placed inside the sound duct, then ANC performance is optimized, but space for additional sensors is reduced

Engineering Contradiction:
ImproveANC performanceVSAvoidspace for additional sensors
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent transitions from a one-dimensional placement (microphone inside sound duct) to a three-dimensional arrangement by placing the microphone in the back volume behind the speaker assembly. This spatial reconfiguration allows the microphone to be positioned optimally for ANC while creating room for additional sensors in the sound duct, effectively resolving the space conflict through dimensional thinking.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If the feedback microphone is placed in the back volume behind the speaker assembly, then space for additional sensors is increased, but acoustic sound delay increases and ANC performance deteriorates

Engineering Contradiction:
Improvespace for additional sensorsVSAvoidANC performance
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent introduces an acoustic lens as an intermediary component between the speaker assembly and the feedback microphone. This acoustic lens focuses and directs sound waves from the speaker to the microphone, enabling the microphone to be positioned in the back volume (providing space for sensors) while maintaining effective acoustic coupling and minimizing sound delay (preserving ANC performance).

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If the housing width is increased to accommodate side-by-side placement of speaker and microphone, then ANC performance is improved, but overall device size increases

Engineering Contradiction:
ImproveANC performanceVSAvoidhousing width
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent moves the microphone placement from a lateral arrangement (side-by-side with speaker, requiring increased housing width) to a depth-based arrangement (behind the speaker assembly in the back volume). This dimensional shift allows optimal microphone positioning for ANC performance while maintaining a compact housing width, effectively resolving the contradiction between performance and device size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables compact in-ear earphones with optimized ANC performance and sufficient space for additional sensors without increasing housing size, while providing passive sound isolation and reduced occlusion.

Implementation Method 1

A first opening (645) is adapted for connecting the first receptacle (670) to a sound duct (340). The at least one opening provides an acoustic connection between the first sound transducer and the sound duct when the first sound transducer is mounted in the first receptacle.

Methodology Applied
Scientific EffectAcoustic connection: Sound

Implementation Method 2

A second opening (655) connects the second receptacle (650) to the first receptacle (670). The second opening provides an acoustic connection between the second sound transducer and the front volume, which is created by a portion of the back side of the transducer holding module when a first transducer has been mounted.

Methodology Applied
Scientific EffectAcoustic connection: Sound

Implementation Method 3

A third opening (625) is for venting the front volume to the ambient air.

Methodology Applied
Scientific EffectVenting: Pressure Gradient

Data Source

PatentEP4622292A1Transducer holding module for earphones
Publication Date: 2025.09.24 SONOVA CONSUMER HEARING GMBH
  • EP4622292A1 patent drawingFigure 1~2
  • EP4622292A1 patent drawingFigure 3~4
  • EP4622292A1 patent drawingFigure 5~6

AI summary

In-ear earphones should be as small as possible. A transducer holding module is disclosed that it allows very compact semi-open in-ear earphones to be made. The transducer holding module (600) comprises a front side (601) and a back side (602), a first receptacle (670) adapted for mounting a first sound transducer (700) on the back side (602), a second receptacle (650) adapted for mounting a second sound transducer (500) on the front side (601), a first opening (645), a second opening (655) and a third opening (625), each connecting the back side with the front side. The first opening (645) is adapted for sound output, the second opening (655) is adapted for connecting a feedback microphone (500) with the front volume (300), and the third opening is a vent.