Transfer Arm Sensor Positioning for 3D Chamber Alignment
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Solution Overview
Problem
Existing substrate processing systems face challenges in accurately positioning transfer arms within processing chambers, particularly in three-dimensional space, due to variations in device models and processing modules, which affect process outcomes and increase startup times.
Innovation Solution
The technology employs a transfer arm equipped with sensors that measure distances and shapes of chamber components, allowing for precise positioning in three-dimensional space within the processing chamber, thereby guiding the transfer arm to an arbitrary teaching position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a reflective distance detection sensor is used to detect substrate position, then the substrate position can be detected, but the positioning accuracy in three-dimensional space is insufficient due to device model variations and assembly errors
Solution Approach 1:
The patent replaces the mechanical/jig-based positioning method with a sensor-based detection system. The reflective distance detection sensor detects distances to multiple reference points (pin, plate, substrate support) to calculate three-dimensional position, eliminating the need for physical jigs and reducing assembly errors.
Solution Approach 2:
The patent transitions from two-dimensional position detection (horizontal plane only) to three-dimensional position detection by adding vertical height measurement. The sensor detects distances to reference points at different heights (pin at substrate level, plate above substrate support) to determine Z-axis position, enabling complete 3D positioning.
2Ease of operation
If manual positioning methods are used to adjust transfer arm position, then positioning can be performed, but the process is time-consuming and reduces work efficiency
Solution Approach 1:
The system performs self-positioning by automatically detecting distances to reference points and calculating the transfer arm position. The controller automatically computes position coordinates based on sensor data, eliminating the need for manual measurement and adjustment operations.
Solution Approach 2:
The sensor provides real-time feedback on the transfer arm position by detecting distances to reference points. The controller uses this feedback to calculate and adjust the position coordinates, enabling automatic closed-loop positioning that improves both ease of operation and productivity.
3Measurement precision
If multiple reference points are detected for three-dimensional positioning, then positioning accuracy improves, but the device complexity increases
Solution Approach 1:
The patent makes the single reflective distance detection sensor multi-functional by having it detect multiple reference points (pin, plate, substrate support) in sequence. The same sensor performs multiple measurement tasks, reducing the need for multiple specialized sensors and maintaining device simplicity while achieving 3D positioning.
Solution Approach 2:
The reference points (pin, plate, substrate support) are pre-positioned during device assembly at known locations. Their positions are predetermined and stored in the controller, so when the sensor detects them, the calculations can directly determine the transfer arm position without requiring complex real-time analysis of multiple independent measurements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables accurate and efficient positioning of the transfer arm, addressing assembly errors and process variations, and improving work efficiency by automating the positioning process under controlled conditions.
Implementation Method 1
a sensor for positioning the transfer arm based on distances, in the processing space, from the transfer arm to the substrate support, the plate member, and the lateral wall unit
Data Source
AI summary
The present disclosure relates to a substrate processing apparatus for processing a substrate, the apparatus comprises: a transfer module for transferring the substrate therein; a transfer arm disposed inside the transfer module and provided with at least one holding arm for holding the substrate; and at least one processing module connected to the transfer module and comprising at least one processing chamber for processing the substrate therein. The at least one processing chamber comprises: a substrate support having a support surface for supporting the substrate; a plate member disposed above the substrate support; and a lateral wall unit configuring an inner surface of the at least one processing chamber, wherein a processing space surrounded by the substrate support, the plate member, and the lateral wall unit is formed in the at least one processing chamber, and the transfer arm comprises a sensor for positioning the transfer arm.