Transfer Arm Container Dry Gas Shielding for Wafer Condensation
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Solution Overview
Problem
Conventional inspection systems face challenges in preventing condensation and congelation of semiconductor wafers during transfer, especially when performing low temperature tests, which can lead to defects in the devices formed on the wafers, particularly in systems with multiple test devices where throughput requirements are high and sufficient standby time is difficult to secure.
Innovation Solution
The inspection system employs a transfer device with a rotatable transfer arm and a shielded container that introduces dry gas, allowing the transfer arm to rotate through different positions to shield the wafer during transfer, maintaining a dry atmosphere and preventing condensation and congelation, while ensuring high throughput by minimizing idle time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional transfer method is used in an inspection system with multiple test devices, then the throughput can be improved by reducing idle time, but condensation and congelation occur in the semiconductor wafer during transfer
Solution Approach 1:
The transfer arm container is preheated to a temperature higher than the semiconductor wafer before the transfer operation. This preliminary heating action ensures that when the wafer is transferred into the container, the temperature difference is already reduced, preventing condensation and congelation during the transfer process while maintaining rapid transfer speeds for high throughput
Solution Approach 2:
The transfer arm container serves as an intermediary environment between the low temperature test chamber and the ambient environment. By controlling the container's temperature to be higher than the wafer temperature, it acts as a thermal buffer that prevents direct exposure of the cold wafer to ambient air, thereby preventing condensation without requiring extended standby times
2Object-affected harmful factors
If a shield container with dry gas supply is used to prevent condensation, then condensation and congelation are prevented, but the system complexity increases
Solution Approach 1:
The invention extracts and isolates the critical function of preventing condensation into a dedicated transfer arm container with heating capability. By separating this function from the main test chambers and using a simple heated container rather than complex shield containers with dry gas supply systems, the solution reduces overall system complexity while effectively preventing condensation
Solution Approach 2:
Instead of using complex pneumatic shield containers with dry gas supply mechanisms, the invention employs a simpler thermal field approach using a heated transfer arm container. This replaces the need for pneumatic systems and gas supply infrastructure, significantly reducing device complexity while achieving the same protective effect
3Object-affected harmful factors
If sufficient standby time is provided on the transfer arm, then the wafer temperature can be increased to prevent condensation, but the throughput decreases
Solution Approach 1:
The transfer arm container is preheated before wafer transfer, eliminating the need for extended standby time. The wafer is transferred directly into the pre-heated container where temperature equalization occurs during the transfer operation itself, maintaining rapid throughput while preventing condensation
Solution Approach 2:
The heated transfer arm container acts as an intermediary that enables rapid temperature equalization between the wafer and ambient environment during the transfer operation itself. This eliminates the need for separate standby heating periods, allowing continuous rapid transfers while preventing condensation through controlled thermal transition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents condensation and congelation during the transfer of semiconductor wafers without compromising the system's throughput, even in systems with multiple test devices, by maintaining a dry atmosphere and allowing for rapid transfer and temperature stabilization of wafers.
Implementation Method 1
a gas introduction mechanism configured to introduce a dry gas into the transfer arm container
Implementation Method 2
a shield member configured to switch the opening portion between an open state and a closed state
Implementation Method 3
a transfer arm configured to be rotatable in a horizontal plane and to hold a substrate
Implementation Method 4
the transfer arm container being rotatable in a horizontal plane
Data Source
AI summary
In a transfer method for transferring a substrate in an inspection system configured to perform a test on electrical characteristics of the substrate, the inspection system including an inspection unit including a plurality of test devices configured to perform the test on the electrical characteristics of a substrate, a loader unit configured to mount a cassette which accommodates a plurality of substrates, and a transfer device configured to transfer a substrate between the inspection unit and the loader unit, an inspected substrate is received by the transfer device from the inspection unit. The inspected substrate received from the inspection unit is transferred toward the loader unit in a state where an opening portion of a transfer arm container of the transfer device. Then, the inspected substrate is delivered to the loader unit.