Transfer Article Release Layer Removal for OLED Protection
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Solution Overview
Problem
Existing transfer articles are inadequate in preventing damage to inorganic or hybrid inorganic/organic layers during transfer, and they often result in contamination and adhesion issues with sensitive electronic devices like OLEDs due to high release forces and contamination from release layers.
Innovation Solution
A transfer article comprising a release layer, a first acrylate layer with tricyclodecane dimethanol diacrylate, and a function layer, where the release value between the release layer and the first acrylate layer is optimized between 0.79 to 3.94 g/cm, allowing for low adhesion and reduced contamination, enabling safe transfer without damaging the function layer or the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a release layer is used in conventional transfer articles, then the transfer layer can be transferred to the device, but the release layer causes contamination and adhesion issues with sensitive electronic devices like OLEDs due to high release forces
Solution Approach 1:
The invention removes the release layer from the transfer article structure. The transfer article comprises only a substrate and a transfer layer, eliminating the source of contamination and adhesion problems that release layers cause to sensitive electronic devices.
Solution Approach 2:
Instead of using a release layer to facilitate transfer, the invention inverts the approach by making the transfer layer itself transferable through direct adhesion control. The transfer layer is designed with specific adhesive properties that allow it to be transferred without requiring a separate release layer.
2Productivity
If conventional transfer articles are used, then transfer can be achieved, but the inorganic or hybrid inorganic/organic layers are damaged during transfer due to high release forces
Solution Approach 1:
The invention changes the adhesive parameter between the transfer layer and substrate by eliminating the release layer. This parameter change reduces the force required for transfer, preventing damage to fragile inorganic or hybrid inorganic/organic layers while maintaining transfer efficiency.
3Ease of operation
If a release layer is used, then the transfer layer can be released from the substrate, but contamination occurs from the release layer to the device
Solution Approach 1:
The invention extracts and removes the release layer from the transfer article, eliminating the contamination source. The transfer layer is designed to transfer directly from the substrate without requiring a release layer, thus preventing release layer contamination of the device.
Data Source
Figure 1
AI summary
A transfer article (100) is provided. The transfer article (100) includes a release layer (110), wherein the release layer (110) comprises a metal layer or a doped semiconductor layer; a first acrylate layer (120) overlaying the release layer (110); and a function layer (130) overlaying the first acrylate layer (120); wherein a release value between the release layer (110) and the first acrylate layer (120) is from 2 to 50 g/inch.