Transfer Base Substrate With Integrated Test Circuit For Semiconductor Yield
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Solution Overview
Problem
Current methods for manufacturing semiconductor devices with thin film circuits on transfer base substrates do not allow for effective pre-transfer defect detection, leading to increased production costs and reduced yield due to the inability to confirm circuit operation before transfer.
Innovation Solution
Incorporating a test circuit and wiring on the transfer base substrate to electrically couple with transfer thin film circuits, enabling immediate defect detection and data collection before transfer, thereby selecting only non-defective circuits for final assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If transfer thin film circuits are formed on a transfer base substrate in separate regions without wiring, then the substrate structure is simple and manufacturing is easier, but circuit operation cannot be confirmed before transferring
Solution Approach 1:
The substrate is divided into multiple regions: transfer thin film circuit formation regions, test circuit formation regions, and wiring regions. This segmentation allows test circuits and wirings to be added without interfering with the transfer thin film circuits, enabling operation verification while maintaining manufacturing simplicity.
Solution Approach 2:
Test circuits and wirings are introduced as intermediary elements on the substrate. These intermediaries enable electrical connection and operation verification of transfer thin film circuits without directly modifying the circuits themselves, thus maintaining ease of manufacture while improving reliability.
2Reliability
If probe contact method is used to check transfer thin film circuits, then circuit operation can be confirmed, but circuits receive damages and checking time increases
Solution Approach 1:
The mechanical probe contact method is replaced with an electrical connection method through wirings and test circuits formed on the substrate. This substitution eliminates mechanical contact and potential damage from probes while enabling non-contact electrical verification of circuit operation.
3Reliability
If probe contact method is used to check each transfer thin film circuit, then circuit operation can be confirmed, but checking time increases significantly
Solution Approach 1:
Multiple transfer thin film circuits are electrically connected through common wirings to a single test circuit. This merging allows simultaneous or sequential testing of multiple circuits through one test point, dramatically reducing the total checking time compared to individual probe contact of each circuit.
Solution Approach 2:
The test circuit and wiring structure serves multiple functions: it provides electrical connection for operation verification, enables simultaneous testing of multiple circuits, and eliminates the need for repeated probe contact. This multi-functionality reduces checking time while maintaining reliability.
4Difficulty of detecting and measuring
If test circuit and wiring are added on transfer base substrate, then defect detection capability is improved, but substrate structure becomes more complex
Solution Approach 1:
Test circuits and wirings are placed in specific local regions of the substrate that are separate from the transfer thin film circuit formation regions. This local placement adds defect detection capability while minimizing the impact on overall substrate structure and maintaining manufacturing simplicity.
Data Source
AI summary
A transfer base substrate comprises: a substrate; a plurality of transfer thin film circuits formed on the substrate via removing layer; a test circuit formed on the substrate for checking circuit operation; and a wiring coupling each of transfer thin film circuits with a test circuit.