Transfer-Board Stacked Circuit Assembly for Space-Constrained Layouts
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Solution Overview
Problem
Circuit board assemblies occupy excessive space, leading to inappropriate spatial layout and increased device size, which affects user experience.
Innovation Solution
A circuit board assembly design featuring a first circuit board stacked with a second circuit board through a first and second transfer board, allowing for staggered and overlapping configurations to enhance space utilization and reduce overall size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more electronic components are added to achieve more functions, then the functionality of the electronic device is improved, but the area occupied by the circuit board assembly increases
Solution Approach 1:
The patent transitions from a planar two-dimensional layout to a three-dimensional stacked configuration. Multiple circuit boards (first circuit board, second circuit board) and transfer boards are arranged in vertical layers, allowing electronic components to be distributed across multiple levels. This dimensional change enables more components to be integrated without increasing the horizontal footprint, directly resolving the contradiction between functionality and area occupation.
Solution Approach 2:
The patent implements a nested hierarchical structure where transfer boards are positioned between circuit boards, creating nested layers. The first transfer board is arranged between the first and second circuit boards, and the second transfer board is arranged between the top of the first transfer board and the bottom of the second circuit board. This nesting approach maximizes space utilization by vertically stacking functional units, enabling enhanced functionality within a compact area.
2Adaptability or versatility
If the circuit board assembly occupies more area to accommodate more components, then more functions can be achieved, but the spatial layout becomes inappropriate and the overall device size increases
Solution Approach 1:
By arranging circuit boards and transfer boards in vertical stacking along the thickness direction, the patent utilizes the third dimension (height) to accommodate more components. This eliminates the need to expand the device's length and width, maintaining a compact overall size while achieving more functions through vertical integration.
Solution Approach 2:
The circuit board assembly is segmented into multiple independent layers (first circuit board, first transfer board, second circuit board, second transfer board), each performing specific functions. This segmentation allows for optimized spatial arrangement where each layer can be independently designed and positioned, improving overall spatial layout efficiency without increasing device dimensions.
3Area of stationary object
If components are stacked in the thickness direction through transfer boards, then space utilization is improved and device size is reduced, but the structural complexity increases
Solution Approach 1:
Transfer boards serve as intermediary components between the first and second circuit boards. These transfer boards facilitate the stacked configuration by providing connection interfaces and structural support, enabling the multi-layer arrangement without requiring direct complex interconnections between circuit boards. The intermediary transfer boards simplify the overall structural complexity while achieving improved space utilization.
Data Source
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AI summary
A circuit board assembly (100) and an electronic device are provided. The circuit board assembly (100) includes a first circuit board (1), a first transfer board (2), a second transfer board (3), and a second circuit board (4). The second transfer board (3) is arranged between a top of the first transfer board (2) and a bottom of the second circuit board (4). The first circuit board (1) is stacked with the second circuit board (4) in a thickness direction of the circuit board assembly (100) sequentially through the first transfer board (2) and the second transfer board (3).