Substrate Transfer Chamber Gas Replacement via Movable Baffle
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Solution Overview
Problem
In semiconductor manufacturing, the existing substrate processing systems face challenges in efficiently replacing gases in the substrate transfer chamber, particularly during maintenance operations, which prolongs the downtime and requires significant amounts of gas for filling the chamber.
Innovation Solution
The substrate transfer chamber incorporates a gas supply and exhaust unit along with a compartment variable device that adjusts the gas flow space volume by vertically moving a transfer unit, allowing for efficient gas replacement by varying the compartment of the gas flow space through a movable member and extensible/contractible member, such as a rectifying plate with openings, in cooperation with a connecting mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the gas replacement time is reduced to minimize system downtime, then the productivity is improved, but the amount of gas required for replacement increases
Solution Approach 1:
The patent applies the dynamics principle by making the gas flow space volume variable rather than fixed. The compartment variable device dynamically adjusts the volume of the gas flow space during the gas replacement process, allowing the system to optimize both replacement time and gas consumption by changing the space configuration in real-time according to the replacement stage.
Solution Approach 2:
The patent implements parameter changes by modifying the volume parameter of the gas flow space. By varying the volume of the gas flow space using the compartment variable device, the system can control the gas replacement process more efficiently, reducing both the time required and the amount of gas needed compared to a fixed-volume system.
2Speed
If a large amount of gas is supplied to quickly fill the chamber, then the gas replacement speed is improved, but the loss of substance increases
Solution Approach 1:
The dynamics principle is applied by dynamically adjusting the gas flow space volume during the replacement process. This allows the system to achieve high replacement speed when needed while minimizing gas consumption by reducing the volume that needs to be filled, thereby reducing substance loss.
Solution Approach 2:
By changing the volume parameter of the gas flow space, the system can optimize the balance between replacement speed and gas consumption. The compartment variable device enables parameter adjustment that allows rapid replacement when the space is small, while reducing gas requirements overall.
Data Source
AI summary
A compartment variable device is provided with: a baffle plate which has a plurality of openings and which as a whole has a rectangular shape; a rectangular frame disposed around the baffle plate; a bellows connected to a bottom of the frame; and a bellows support portion to which the lower end of the bellows is fixed. When a transfer arm of an atmosphere-side transfer device is lifted, the frame of the compartment variable device which is engaged with the transfer arm is lifted, thereby extending the bellows. Accordingly, the volume of a gas flow space in an atmospheric pressure transfer chamber is decreased, allowing the atmosphere in the gas flow space in the atmospheric pressure transfer chamber to be replaced in a short time.