Transfer Chamber Humidity Control for Defect-Free Substrate Handling

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Solution Overview

Problem

During the manufacturing of semiconductor and display devices, substrates subjected to exposure processes are prone to defects such as leaning, bridge, and hopping of photoresist films due to moisture and organic fumes, and are vulnerable to damage during transfer within apparatuses.

Innovation Solution

An apparatus and method that includes a first process chamber for developing substrates with a developer, a second process chamber for drying using supercritical fluids, and a transfer chamber with a temperature and humidity control system to manage the environment, ensuring substrates are kept in a consistent temperature and humidity state during transfer to prevent contamination and damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If substrate is transferred multiple times within apparatus after exposure process, then processing can be completed, but substrate becomes vulnerable to defects caused by moisture and organic fume

Engineering Contradiction:

Improveprocessing completionVSAvoidsubstrate defect rate

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

A transfer chamber is introduced as an intermediary environment between process chambers. This transfer chamber maintains controlled temperature and humidity conditions, acting as a protective mediator that prevents moisture and organic fume contamination during substrate transfer, thereby reducing defects while enabling multi-step processing

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The transfer chamber creates an inert environmental atmosphere with controlled temperature and humidity. This controlled environment isolates the substrate from harmful external conditions (moisture and organic fumes) during transfer operations, allowing multiple transfers without increasing defect rates

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

2Ease of manufacture

If developer is supplied onto substrate in first process chamber, then developing process is achieved, but substrate remains vulnerable during transfer to second process chamber

Engineering Contradiction:

Improvedeveloping processVSAvoidcontamination during transfer

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The transfer chamber serves as a protective intermediary that receives the substrate with developer from the first process chamber and transports it to the second process chamber. The controlled temperature and humidity environment of the transfer chamber prevents contamination during this vulnerable transfer phase, protecting both the substrate and developer

Inventive Principle:

Principle #24Intermediary (Mediator)

3Device complexity

If temperature and humidity are not controlled during substrate transfer, then apparatus operation is simpler, but process defects increase due to moisture and organic fume

Engineering Contradiction:

Improveapparatus operationVSAvoidprocess defect rate

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The transfer chamber implements active control of temperature and humidity parameters. By maintaining these environmental parameters within specific ranges, the system prevents moisture and organic fume-related defects during substrate transfer, achieving high reliability while the controlled environment management remains integrated into the apparatus operation

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces process defects by maintaining a controlled environment during substrate transfer, preventing cross-contamination and damage to photoresist films, thereby enhancing the reliability of semiconductor and display device manufacturing processes.

Implementation Method 1

a temperature and humidity control system configured to manage temperature and humidity of the transfer chamber by supplying a first gas of constant temperature and humidity into the transfer chamber

Methodology Applied

Scientific EffectTemperature and humidity control:

Implementation Method 2

at least one second process chamber configured to treat the substrate using a supercritical fluid

Methodology Applied

Scientific EffectSupercritical fluid: Supercritical Fluid

Data Source

PatentUS11923216B2Apparatus and method for treating substrate including process chambers and transfer chamber

Publication Date: 2024.03.05 SAMSUNG ELECTRONICS CO LTD

AI summary

An apparatus and method for treating a substrate are provided. The apparatus includes at least one first process chamber configured to supply a developer onto the substrate; at least one second process chamber configured to treat the substrate using a supercritical fluid; a transfer chamber configured to transfer the substrate from the at least one first process chamber to the at least one second process chamber, while the developer supplied in the at least one first process chamber remains on the substrate; and a temperature and humidity control system configured to manage temperature and humidity of the transfer chamber by supplying a first gas of constant temperature and humidity into the transfer chamber.