Transfer Chamber Moisture Purge in Substrate Processing
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Solution Overview
Problem
In substrate processing apparatuses, moisture accumulation in low temperature regions of the transfer chamber reduces yield due to unintended modification of substrates, and heating the entire chamber to remove moisture can damage components.
Innovation Solution
A substrate processing apparatus with a detector to monitor moisture levels and an inert gas supplier that locally supplies inert gas to the low temperature region to physically remove moisture without raising the temperature, using a distributor to disperse the gas effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entirety of the transfer chamber is heated to remove moisture, then the moisture removal effectiveness is improved, but the components in the transfer chamber may be damaged due to excessive heat
Solution Approach 1:
The transfer chamber is divided into multiple temperature zones: a first region adjacent to the process chamber with higher temperature, and a second region adjacent to the load lock chamber with lower temperature. The heating device selectively heats only the first region, while the second region remains at lower temperature to protect components. This segmentation allows effective moisture removal from critical areas without subjecting heat-sensitive components to excessive heat.
Solution Approach 2:
Different regions of the transfer chamber are assigned different temperature characteristics tailored to their specific requirements. The first region receives localized heating to achieve temperatures sufficient for moisture removal, while the second region maintains lower temperatures suitable for heat-sensitive components. This local quality approach ensures each region has the appropriate thermal environment for its function.
2Reliability
If the transfer chamber is heated to remove moisture, then the moisture amount is reduced, but energy consumption increases due to heating the entire chamber
Solution Approach 1:
The heating device is configured to heat only specific regions (the first region adjacent to the process chamber) rather than the entire transfer chamber. This segmented heating approach concentrates energy where it is most needed for moisture removal, significantly reducing overall energy consumption compared to heating the entire chamber.
Solution Approach 2:
Instead of applying heating uniformly across the entire transfer chamber, the system applies partial heating only to the first region where moisture removal is most critical. This partial action principle avoids the excessive energy consumption of full-chamber heating while achieving sufficient moisture removal effectiveness.
3Reliability
If the temperature in the second region is increased to remove moisture, then moisture removal is improved, but the components in the second region may be damaged
Solution Approach 1:
The transfer chamber is segmented into a first region for heating and a second region for component protection. The heating device is positioned to affect only the first region, creating a temperature gradient where the second region remains at lower temperatures safe for heat-sensitive components while still achieving effective moisture removal in the first region.
Solution Approach 2:
The second region is designed with local quality characteristics that maintain lower temperatures suitable for heat-sensitive components. This local temperature control ensures that components in the second region are protected from thermal damage while the first region achieves the higher temperatures needed for moisture removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces moisture in low temperature regions without damaging components, maintaining yield and substrate integrity.
Implementation Method 1
an inert gas supplier capable of supplying an inert gas toward the second region in the transfer chamber
Implementation Method 2
a detector capable of detecting an amount of moisture in the transfer chamber
Implementation Method 3
a process chamber provided with a heater
Data Source
AI summary
Described herein is a technique capable of reducing an amount of moisture in a low temperature region in a substrate processing apparatus provided with a transfer chamber. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber provided with a heater; a load lock chamber; a transfer chamber provided between the process chamber and the load lock chamber and including a first region provided adjacent to the process chamber and a second region provided more adjacent to the load lock chamber than the first region and whose temperature is lower than a temperature of the first region; a detector capable of detecting an amount of moisture in the transfer chamber; and an inert gas supplier capable of supplying an inert gas toward the second region in the transfer chamber.