Transfer Chamber Temperature Control for Substrate Processing

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Solution Overview

Problem

Substrate processing apparatuses with multiple process chambers and transfer chambers consume excessive energy due to inefficient temperature control during substrate transfers.

Innovation Solution

A substrate processing apparatus with a first and second process chamber, a transfer chamber, and a temperature control mechanism, controlled by a controller, to manage temperature changes during substrate transfers between chambers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If temperature control is continuously maintained in the transfer chamber during substrate transfers, then substrate temperature stability is improved, but energy consumption increases excessively

Engineering Contradiction:
Improvesubstrate temperature stabilityVSAvoidenergy consumption
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The temperature control mechanism operates periodically rather than continuously. The controller activates the temperature control mechanism only when the substrate is present in the transfer chamber and deactivates it when the substrate is transferred out, creating a periodic on-off operation pattern that reduces energy consumption while maintaining temperature stability when needed

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The temperature control system transitions from a static continuous operation mode to a dynamic adaptive mode. The controller dynamically adjusts the operation state of the temperature control mechanism based on real-time substrate presence detection, making the system responsive to actual processing needs and eliminating wasteful continuous operation

Inventive Principle:
Principle #15Dynamics

2Productivity

If the substrate is transferred between process chambers at higher temperatures, then processing efficiency is improved, but damage to the transfer mechanism increases

Engineering Contradiction:
Improveprocessing efficiencyVSAvoidtransfer mechanism durability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

Different temperature conditions are applied to different locations and times in the transfer process. The substrate maintains higher temperature during the brief transfer moment, but the transfer mechanism and chamber environment are kept at lower temperatures, creating localized temperature management that protects the transfer mechanism while enabling efficient substrate transfer

Inventive Principle:
Principle #3Local quality

3Measurement precision

If the temperature control mechanism operates at high output continuously, then temperature control precision is improved, but energy consumption increases

Engineering Contradiction:
Improvetemperature control precisionVSAvoidenergy consumption
Core Design Contradiction:
Measurement precisionVSUse of energy by moving object

Solution Approach 1:

The temperature control mechanism operates at high output only when necessary (when substrate is present), rather than continuously. The controller provides full temperature control precision during the substrate transfer window, then reduces or stops operation when the substrate is absent, achieving the required precision without excessive energy consumption

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces energy consumption and improves throughput by optimizing temperature control during transfers, minimizing damage to transfer mechanisms, and reducing energy use.

Implementation Method 1

a temperature control mechanism configured to perform temperature control on a predetermined target in the transfer chamber

Methodology Applied
Scientific EffectTemperature control: Heating

Implementation Method 2

a transfer mechanism configured to transfer the substrate

Methodology Applied
Scientific EffectMechanical transfer: Mechanical Force

Data Source

PatentUS20250259865A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording medium
Publication Date: 2025.08.14 KOKUSAI DENKI KK
  • US20250259865A1 patent drawing
  • US20250259865A1 patent drawing
  • US20250259865A1 patent drawing

AI summary

A technique includes: (a) a first process chamber in which processing of causing a temperature of a substrate to be a first temperature is performed; (b) a second process chamber whereby processing of causing a temperature of the substrate to be a second temperature higher than the first temperature is performed; (c) a transfer chamber formed in communication with the first process chamber and the second process chamber and including a transfer mechanism configured to transfer the substrate; (d) a temperature control mechanism configured to perform temperature control on a predetermined target in the transfer chamber; and (e) a controller capable of controlling the transfer mechanism and the temperature control mechanism to perform control with contents of transfer of the substrate between the first process chamber and the second process chamber and control with contents of the temperature control in accordance with the contents of transfer to be performed.