Transfer-Chamber Wafer Defect Inspection for Real-Time Detection
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Solution Overview
Problem
During semiconductor fabrication, defects such as organic contaminants, metal impurities, scratches, cracks, chipping, and breakages are difficult to detect efficiently in real-time, leading to potential failures in the manufacturing process.
Innovation Solution
A defect inspection system comprising an information-obtaining module with a light source and optical detector, which generates an image signal by irradiating and reflecting light from the substrate, and a defect inspection module that compares this signal with references to detect defects, utilizing an optical path changer and multiple sub-light sources with varying wavelengths and angles to optimize inspection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If macro inspection or in-line automatic optical inspection is used to detect defects, then defect detection capability is provided, but real-time detection efficiency is insufficient
Solution Approach 1:
The system performs preliminary defect detection during the transfer process between fabrication chambers before the substrate enters the next processing step. The inspection apparatus is positioned in the transfer chamber to capture images of substrates during transfer, enabling early defect identification without interrupting the fabrication flow.
Solution Approach 2:
The inspection apparatus operates continuously during substrate transfer using multiple cameras that capture images at different positions and angles simultaneously. The system maintains continuous inspection coverage by coordinating multiple imaging devices to photograph the substrate surface from various perspectives as it moves through the transfer chamber.
2Measurement precision
If multiple inspection angles and wavelengths are used to improve detection accuracy, then defect detection accuracy is improved, but system complexity increases
Solution Approach 1:
The inspection system is divided into multiple independent camera modules, each equipped with specific lighting sources for different wavelengths and angles. Each camera module functions as an independent inspection unit that can be individually configured and controlled, allowing the system to achieve multi-angle and multi-wavelength inspection while maintaining modular simplicity.
Solution Approach 2:
The inspection apparatus uses multiple cameras and light sources that can be configured to perform various inspection functions. The same camera system can inspect different defect types by adjusting lighting angles and wavelengths, making the system versatile without requiring separate dedicated inspection devices for each defect type.
3Measurement precision
If inspection is performed after each fabrication process, then comprehensive defect coverage is achieved, but manufacturing time increases
Solution Approach 1:
The system performs preliminary defect detection during the transfer process between fabrication chambers before the substrate enters the next processing step. This timing allows defect identification without adding separate inspection steps to the fabrication sequence, as the transfer process time is utilized for inspection purposes.
Solution Approach 2:
The inspection function is merged with the existing substrate transfer process. The inspection apparatus is positioned in the transfer chamber to capture images during substrate movement, combining the transfer operation with inspection operations into a single integrated process that achieves both objectives simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time detection of defects with high resolution and accuracy, reducing manufacturing time and allowing for immediate corrective actions, thereby improving the quality and reliability of semiconductor fabrication.
Implementation Method 1
The optical detector may collect a reflected light from the substrate to generate an electrical signal with respect to the reflected light
Implementation Method 2
The optical detector may collect a reflected light from the substrate to generate an electrical signal with respect to the reflected light
Data Source
AI summary
A defect inspection system may include an information-obtaining module and a defect inspection module. The information obtaining module may be arranged over a transferring apparatus to continuously photograph a surface of a substrate transferred by the transferring apparatus. The defect inspection module may generate an image signal based on information of the substrate provided from the information-obtaining module. The defect inspection module may compare the image signal with a reference to detect a defect of the substrate.