Transfer Film Support Frame for Large-Scale Electronic Device Manufacturing
Solution Overview
Problem
Current methods are unable to efficiently transfer large-scale films during electronic device manufacturing, as they face challenges in handling and adhering functional layers to target substrates without damaging the layers or compromising mechanical strength.
Innovation Solution
A method involving a transfer film with a support frame having holes, where the support frame's adhesiveness is reduced by temperature or UV radiation, allowing for the detachment and transfer of functional layers from a source substrate to a target substrate with minimized stress on the layers, maintaining mechanical strength and ease of handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a large-scale film is transferred using conventional methods, then the transfer area is limited, but the handling difficulty and mechanical strength compromise increase
Solution Approach 1:
The support frame is divided into multiple segments connected by flexible joints, allowing the large-scale support frame to be assembled from smaller components and manipulated more easily. This segmentation enables handling of large areas while maintaining operational ease.
Solution Approach 2:
A support frame acts as an intermediary structure that provides mechanical strength and handling capability to large-scale transfer films. The support frame with flexible joints serves as a mediator between the transfer film and the operator, enabling control of large areas without directly handling the fragile film.
2Strength
If the support frame adhesiveness is high, then the transfer film is securely held, but the detachment process becomes difficult and may damage the functional layers
Solution Approach 1:
The support frame incorporates flexible joints that allow dynamic adjustment of the frame structure. This flexibility enables the frame to adapt during attachment and detachment processes, reducing stress on the functional layers while maintaining secure holding during transfer operations.
Solution Approach 2:
The adhesiveness parameter of the support frame is optimized to provide sufficient holding strength during transfer while allowing controlled detachment. The flexible joints enable parameter changes in the mechanical properties of the support frame, facilitating easy detachment without damaging the functional layers.
3Strength
If the support frame is rigid, then the mechanical strength is high, but the stress on functional layers during detachment increases
Solution Approach 1:
The support frame uses flexible joints to transition from a rigid structure to a dynamic, adaptable structure during detachment. This allows the frame to flex and reduce stress concentrations on the functional layers while maintaining overall mechanical strength for handling and transfer operations.
Solution Approach 2:
The flexible joints in the support frame provide beforehand cushioning by absorbing and distributing mechanical stresses before they reach the functional layers. This prior cushioning effect protects the functional layers from damage during the detachment process while maintaining the structural integrity needed for large-scale transfers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient large-scale transferring of functional layers with reduced stress and damage, facilitating the manufacturing of electronic devices and other thin film structures like transistors, optical elements, and coating films.
Implementation Method 1
the detaching of the support frame may include decreasing the adhesiveness of the support frame by increasing temperature
Implementation Method 2
the adhesiveness of the support frame may be decreased when ultraviolet rays are radiated onto the support frame
Data Source
AI summary
A method of manufacturing an electronic device is provided to realize efficient large-scale transferring. The method includes locating a transfer film over a plurality of functional layers separated from each other over a source substrate; attaching a support frame to the transfer film, the support frame having a plurality of holes spaced apart from each other; removing the source substrate from the transfer film, with the plurality of functional layers being in close contact with a bottom surface of the transfer film; locating the transfer film over a target substrate, with the plurality of functional layers being in close contact with the bottom surface of the transfer film; detaching the support frame from the transfer film; and removing the transfer film from the target substrate.