Substrate Transfer Frame Gas Flow Interference Member
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Solution Overview
Problem
Current semiconductor manufacturing processes require large amounts of inert gas to maintain a clean atmosphere during substrate transfer, leading to high processing costs and particle generation due to gas collisions within the transfer space.
Innovation Solution
A substrate processing apparatus with a transfer frame that includes a fan unit for descending gas flow and an interference member to minimize gas collisions, along with a gas supply system that divides the gas supply period into charging and transfer phases, and circulation ducts to optimize gas usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fan supplies inert gas into the transfer space to maintain inert gas atmosphere, then the transfer space is maintained in inert gas atmosphere, but a vast amount of inert gas is used
Solution Approach 1:
The transfer space is filled with inert gas before the substrate transfer operation begins. This preliminary action ensures that the inert gas atmosphere is already established when the substrate is introduced, eliminating the need for continuous gas supply during the transfer process and thereby reducing overall inert gas consumption.
Solution Approach 2:
Instead of continuous gas supply, the system uses periodic action by filling the transfer space with inert gas at specific intervals or before each transfer operation. This approach maintains the protective atmosphere only when necessary, significantly reducing the total amount of inert gas required compared to continuous supply methods.
2Reliability
If inert gas is supplied into the FOUP to prevent gas flow introduction, then the substrate is protected from oxidation, but a vast amount of inert gas is used
Solution Approach 1:
The FOUP is pre-filled with inert gas before the substrate is placed inside or before transfer operations begin. This preliminary filling ensures that the protective atmosphere is already in place, preventing oxidation without requiring continuous gas supply during storage or transfer, thereby reducing overall inert gas consumption.
Solution Approach 2:
The system applies inert gas protection locally and selectively - filling the FOUP with inert gas only when substrates are present and require protection, rather than maintaining continuous gas flow. This localized approach ensures substrate protection from oxidation while minimizing unnecessary inert gas consumption during periods when substrates are not being processed.
3Reliability
If fan supplies inert gas continuously, then transfer space is maintained in inert gas atmosphere, but inert gas is required to be consistently supplied
Solution Approach 1:
The system transitions from continuous gas supply to periodic action by filling the transfer space with inert gas at the beginning of each transfer cycle or when needed. This periodic replenishment maintains the protective atmosphere throughout the substrate transfer process without requiring continuous supply, thereby extending the effective duration of inert gas protection while reducing overall consumption.
4Productivity
If fan supplies inert gas, then gas flow is created in transfer space, but gas collision causes vortex and particles
Solution Approach 1:
The transfer space is pre-filled with inert gas before substrate transfer begins, establishing a stable atmosphere without requiring active gas flow during the transfer operation. This preliminary action eliminates the need for continuous fan operation, thereby preventing vortex formation and particle generation while maintaining substrate transfer efficiency.
Solution Approach 2:
The system extracts or removes the fan component from the transfer space configuration, relying instead on pre-filled inert gas to maintain the protective atmosphere. By eliminating the fan, the source of gas flow-induced vortices and particle generation is removed, while substrate transfer efficiency is maintained through the established inert gas environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the amount of inert gas consumption, minimizes particle generation, and prevents attachment of particles to substrates by efficiently managing the gas flow and atmosphere within the transfer space.
Implementation Method 1
a fan unit provided above the transfer space to supply a descending flow of gas into the transfer space
Implementation Method 2
the inert gas supplied by the fan 2 and the inert gas released from the FOUP 4 collide with each other to cause a vortex in the transfer space 3
Data Source
AI summary
Disclosed is a substrate processing apparatus that includes an interference member for minimizing a collision between a descending flow of gas supplied by a fan unit and a gas flow directed toward a transfer space from the inside of a container.