Transfer Head Array With Continuous Wall For Micro Device Packaging
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Solution Overview
Problem
The manufacturing of micro devices such as semiconductor sensors, semiconductor laser arrays, and MEMS/LED display systems faces challenges due to packaging issues, particularly in the transfer process from a carrier substrate to a receiving substrate, where traditional bonding methods can lead to mechanical interference and stability problems.
Innovation Solution
A transfer head array design featuring a continuous wall portion between transfer heads, allowing most components to be on the same plane, enhancing stability and simplifying the manufacturing process by ensuring all transfer heads and associated components are on the same plane, with recesses to accommodate varying device heights and prevent mechanical interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional bonding methods are used for transferring micro devices from carrier substrate to receiving substrate, then the transfer process can be completed, but mechanical interference and stability problems occur
Solution Approach 1:
The transfer head is divided into multiple independent transfer units, each capable of handling individual micro devices. This segmentation allows precise control of each transfer unit, preventing mechanical interference between adjacent devices during the transfer process from carrier substrate to receiving substrate.
Solution Approach 2:
The transfer head acts as an intermediary device between the carrier substrate and receiving substrate. It provides a stable intermediate platform with controlled bonding and release mechanisms, eliminating direct mechanical interference that would occur in traditional bonding methods.
2Ease of manufacture
If transfer heads and associated components are located on different planes, then flexibility in component placement is achieved, but manufacturing complexity and structural stability are reduced
Solution Approach 1:
Multiple transfer heads and their associated components are merged onto a single plane of the transfer head body. This consolidation simplifies the manufacturing process by eliminating the need for complex multi-level alignment and assembly, while maintaining structural stability through a unified planar configuration.
Data Source
AI summary
A transfer head array includes a body and a plurality of transfer heads. The body includes a base portion and at least one wall portion. The wall portion is located on and stationary to the base portion. The wall portion has a top surface. The transfer heads are located on the top surface of the wall portion. The wall portion is continuous at least between two of the transfer heads.