Transfer Head Arrays for Micro Device Mass Transfer
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Solution Overview
Problem
The challenge in manufacturing and packaging of micro devices lies in efficiently transferring a large number of micro devices, particularly in fields like RF, LED, and MEMS, where existing methods struggle with mass transfer efficiency.
Innovation Solution
A transfer head with arrays of grip regions, where columns are electrically connected and controlled by single or dual voltage sources, allows for iterative placement of micro devices onto a receiving substrate, reducing redundant movement and enhancing efficiency by embedding arrays partially during the transfer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a transfer head transfers micro devices one array at a time using conventional methods, then the transfer process can be completed, but the moving distance between iterations is large and transfer efficiency is low
Solution Approach 1:
The transfer head is divided into multiple independent arrays (first array and second array), each capable of picking up and placing micro devices independently. This segmentation allows the transfer head to perform iterative transfers with reduced moving distance, as one array can be placing devices while another picks up devices, eliminating the need to return to the source substrate after each placement.
Solution Approach 2:
The transfer head pre-positions multiple arrays of grip regions in advance, with each array configured to match the array pattern of micro devices on the source substrate. This preliminary configuration enables the transfer head to pick up multiple arrays of micro devices simultaneously and perform iterative placements without repositioning the grip regions, significantly reducing moving distance and improving transfer efficiency.
2Ease of operation
If multiple voltage sources are used to control each column independently, then precise control of grip regions is achieved, but device complexity and control circuit requirements increase
Solution Approach 1:
Multiple columns of grip regions within each array are electrically connected in parallel to a single voltage source. This merging approach maintains precise control over each array while reducing the total number of voltage sources required, thereby simplifying the control system and reducing device complexity compared to controlling each column independently.
Solution Approach 2:
Each voltage source is designed to control multiple columns within an array, making the voltage source multi-functional. This universal control approach allows a single voltage source to manage multiple grip regions simultaneously, reducing the overall complexity of the control circuit while maintaining the ability to precisely control each array for accurate micro device transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces the moving distance of the transfer head between iterations, enhancing the efficiency of transferring a large number of micro devices, such as 0.1 to 1 million, by optimizing the placement process and design of the transfer head.
Implementation Method 1
The grip regions in one of the columns are electrically connected in series. The columns in one of the arrays are controlled by a single voltage source, and the columns in two of the arrays are controlled by two voltage sources respectively.
Data Source
AI summary
A method for transferring a plurality of micro devices e is provided. The method includes picking up the micro devices from a carrier substrate by a transfer head, and iteratively performing a placing process. The placing process includes moving the transfer head to a position, at which an array of the micro devices is positioned over an array of receiving locations of a receiving substrate, and placing said array of the micro devices onto the array of the receiving locations of the receiving substrate.