Transfer Laminate Seed Layer for Smooth Copper Adhesion
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Solution Overview
Problem
Existing methods for forming copper layers on printed wiring boards and plastic molded articles face challenges such as high costs, the need for large-scale vacuum facilities, surface roughening, and inconsistent quality, especially in high-frequency applications and with environmentally hazardous substances.
Innovation Solution
A transfer layered body is created by forming a plating seed layer with a dispersant and electrically conductive material on a temporary support, followed by a resin layer with functional groups that react to form a chemical bond, allowing easy lamination and removal to achieve stable adhesion without surface roughening.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If copper foil or substrate is roughened to achieve sufficient adhesion, then adhesion between copper foil and substrate is improved, but the pitch of the printed wiring board cannot be reduced
Solution Approach 1:
The invention changes the surface morphology parameter from rough to smooth by using a sputtering method to form a metal film on a polyimide film, eliminating the need for surface roughening while maintaining adhesion through the sputtered metal layer
Solution Approach 2:
The invention replaces the mechanical roughening process with a sputtering-based film formation process, where a metal film is deposited on the substrate surface through physical vapor deposition, achieving adhesion without mechanical surface modification
2Strength
If copper foil or substrate is roughened to achieve sufficient adhesion, then adhesion between copper foil and substrate is improved, but transmission loss in high-frequency ranges increases
Solution Approach 1:
The invention changes the surface morphology from rough to smooth, which reduces surface resistance and minimizes transmission loss in high-frequency ranges while maintaining adhesion through the sputtered metal film
Solution Approach 2:
The invention replaces mechanical roughening with sputtering-based film deposition, creating a smooth metal film that provides both adhesion and low transmission loss for high-frequency signals
3Strength
If sputtering method is used to form thin metal film, then adhesion without surface roughening is achieved, but a large-scale vacuum facility is needed
Solution Approach 1:
The invention uses a transfer laminate approach where a metal film is first formed on a temporary support in a controlled environment, then transferred to the final substrate, allowing the use of smaller facilities instead of large-scale vacuum facilities
4Adaptability or versatility
If sputtering method is applied to both sides of substrate, then complete metal coating is achieved, but time required to evacuate facility is doubled
Solution Approach 1:
The invention divides the coating process into two independent stages: first forming the metal film on the temporary support, then transferring it to the substrate. This segmentation allows the facility to be evacuated and pressurized multiple times without doubling the total time, as the transfer occurs after the metal film is already formed
Solution Approach 2:
The invention performs the metal film formation on the temporary support before the final substrate is introduced, allowing the facility to be prepared and evacuated in advance, then the pre-formed metal film is transferred to the substrate without requiring re-evacuation
5Ease of manufacture
If primer layer and metal nanoparticle layer are applied sequentially, then metal layer formation is achieved, but processing time is extended
Solution Approach 1:
The invention extracts and eliminates the primer layer from the process by using a sputtering-based metal film formation method that directly deposits the metal film onto the substrate or temporary support, reducing the number of processing steps and time required
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables low-cost, high-quality formation of copper layers with improved adhesion and reduced defects, suitable for various electronic components and decorative applications.
Implementation Method 1
a plating seed layer (B) containing a dispersant (b1) and an electrically conductive material (b2)
Implementation Method 2
the signal intensity of carbon atoms in the plating seed layer (B) that is measured by glow discharge optical emission spectrometry is larger on a resin layer (C) side than on a temporary support (A) side
Implementation Method 3
a transfer layered body including a plating seed layer and a resin layer that are disposed in this order on a temporary support
Data Source
AI summary
The layered body includes a seed layer that serves as a base for plating and that can be formed using a simple and low-cost method capable of ensuring stable quality and preventing the occurrence of scratches on the plating seed layer due to contact with a coating apparatus during application and contact with conveyor rollers. The layered body can provide good adhesion between a support and a metal layer (metal plating layer) without roughening the surface of the support. The transfer layered bodies is produced by forming a plating seed layer containing a dispersant and an electrically conductive material on a temporary support, forming a resin layer on the plating seed layer, and then allowing functional groups in the plating seed layer and functional groups in the resin layer to react with each other.